Three-D integrated memory

Abstract

In the 3-D integrated memory (3DiM) the 3-D memory and conventional readable / writable memory and / or data processor are integrated on a chip. As compared with standalone 3D-M its global property (for example speed, finished product rate, programmability and data safety, etc.) is more excellent. Said invented 3-D integrated memory can be used in the integrated circuit test and others.

Description

technical field [0001] The present invention relates to the field of integrated circuits, more specifically, to a three-dimensional integrated memory. Background technique [0002] In a three-dimensional integrated circuit (abbreviated as 3D-IC), one or more three-dimensional integrated circuit layers (abbreviated as 3D-IC layers) are stacked on a substrate in a direction perpendicular to the substrate. The 3D-IC layer is composed of non-single crystal (ie, polycrystalline or amorphous) semiconductor materials, which can have functions such as logic, storage, and simulation. For 3D-IC layers with logic and analog functions, they are more sensitive to defects. Due to the high defect density of non-single crystal semiconductor materials, the yield of this type of 3D-IC is not high. At the same time, the power consumption of logic and analog functions is high, and their three-dimensional integration faces a large heat dissipation problem. In contra...

AI Technical Summary

Problems solved by technology

Standalone 3D-M needs to be improved in terms of read and write speed, yield, programmability, etc.

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