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Semiconductor lead frame

A semiconductor and lead frame technology, applied in the field of semiconductor lead frames, can solve the problems of expensive equipment, large connecting wires, and high product costs, and achieve the effects of reduced manufacturing costs, increased mounting density, and low pressing capacity

Inactive Publication Date: 2003-07-30
SHARP KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At this time, if the forming position of the connecting line portion is simply placed close to the resin case side, there will be a problem that the connecting line portion cannot be cut due to errors caused by deviation of the casting mold and wear of the punch, etc. Or a large burr is generated on the connection line, etc.
[0014] In conduction molding, in order to prevent resin leakage, etc., a high-pressure press is used to apply pressure to the mold, clamp the lead frame, and fill the resin. However, the high-pressure press is expensive, the equipment cost is expensive, and the product cost is high.

Method used

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  • Semiconductor lead frame
  • Semiconductor lead frame
  • Semiconductor lead frame

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] figure 1 and Fig. 2 is a plan view showing Embodiment 1 of the semiconductor lead frame of the present invention, figure 1 2(a) shows the light-receiving side lead frame, and FIG. 2(b) shows the light-emitting side lead frame.

[0037] Method of manufacturing opposed optocoupler devices by two-layer conductive molding, and Figure 10 The manufacturing method represented by the state of the art is exactly the same. In addition, its structure is also the same as Figure 9 The structure represented is the same, so in the following description, the same as Figure 9 and Figure 10 The same symbols are used for explanation.

[0038] Here, a method of manufacturing a two-layer conductive mold-type opposed photocoupler will be briefly described.

[0039]First, the light-emitting element 17 and the light-receiving element 18 are connected and mounted on the frame holder 11a of the light-emitting element side lead frame 100a and the frame holder 11b of the light-receiving ...

Embodiment 2

[0050] Image 6 It shows the state after secondary conduction molding of the planar mount optical coupler.

[0051] This planar mount type optical coupling element is also similar to the opposed type optical coupling element shown in the first embodiment, and is close to the resin case 15, and forms secondary connecting line portions 4a2, 4b2. In addition, in order to prevent failures at the time of cutting the connecting wires caused by bringing the secondary connecting wires 4a2, 4b2 close to the resin case 15, the side edges on the side of the secondary connecting wires 4a2, 4b2, that is, the resin The opposite side edge of the housing 15 is the part that is punched out by the punch when the connecting wire is cut (ie, the two sides of the inner leads 12a, 12b), respectively forming the first notch 1 .

[0052] The manufacturing method of such a planar mounted optical coupling element is basically the same as that of the opposed optical coupling element, but the major diff...

Embodiment 3

[0057] FIG. 7 and FIG. 8 show an example of a shape that is further carefully designed and formed in the portion of the first notch portion 1 described in the first and second embodiments.

[0058] That is, in FIG. 7, the connecting line parts (in embodiment 1, connecting line parts 14a, 14b, in embodiment 2, the connecting line parts 4a1, 4b1 and two) that are washed away by the punch when the connecting line is cut are The punched out part of the secondary connecting line part 4a2, 4b2) (ie the plane of the connecting line part of the part corresponding to the first notch part 1) forms a V-shaped groove along the punching direction of the punch.

[0059] By forming the V-shaped groove in this way, it is possible to further reduce remaining burrs and abrasion of the punch when the connecting wire is cut.

[0060] In addition, in Fig. 8, embossing is carried out, and the connecting line parts (connecting line parts 14a, 14b in embodiment 1 and primary connecting line parts in ...

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PUM

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Abstract

In a lead frame which has second tie bars in the vicinity of plastic packages first notches are formed along first edges of the second tie bars (in areas defined on both sides of the inner leads and to come into contact with a punch during the tie bar cutting step). The first notches prevent troubles associated with close arrangement of the second tie bars and the plastic packages. In addition, second notches are provided along second edges of the second tie bars. These second notches are designed to receive the tips of outer leads which extend from neighboring plastic packages of the lead frames.

Description

technical field [0001] The present invention relates to a lead frame for semiconductors used in the manufacture of resin-sealed semiconductor devices, and more specifically, to a lead frame for semiconductors in which a semiconductor device and an optical coupling element are formed using a conductive mold. Background technique [0002] Generally speaking, the manufacturing process of a resin-sealed semiconductor device includes the following steps: a process of mounting a chip on a lead frame; a wire connection process of electrically connecting the mounted chip and the lead part; The molding process; and the connecting line cutting process, cutting the connecting line part, and the connecting line part fulfills the task of preventing the resin from flowing out during the conduction molding process. [0003] In this connecting wire cutting process, the lead frame is pressed and fixed with the connecting wire cutting die, and the thick burrs (resin deposits remaining in the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/48H01L21/56H01L23/495H01L23/50H01L31/167
CPCH01L23/49541H01L31/167H01L24/48H01L2224/48091H01L21/565H01L2224/48247H01L2224/05599H01L2224/45099H01L2224/85399H01L2924/00014H01L2224/8592H01L2924/181H01L2224/45015H01L2924/207H01L2924/00012
Inventor 安田义树高仓英也
Owner SHARP KK