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Imaging device packaging, camera module and the producing process of the camera module

An imaging device and camera technology, applied to the camera body, camera, circuit device, etc., can solve the problems of difficulty in improving the signal-to-noise ratio, insufficient improvement, etc., and achieve the effect of reducing the number of

Inactive Publication Date: 2004-03-17
KYOCERA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0023] However, as shown in Fig. 23A, 21a and 21b are actually superimposed on the weak video signal, making it difficult to improve the signal-to-noise ratio
[0024] In other words, although the signal-to-noise ratio in the bare chip package of the ceramic board 36 and the imaging device 32 is improved, the improvement is not sufficient.

Method used

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  • Imaging device packaging, camera module and the producing process of the camera module
  • Imaging device packaging, camera module and the producing process of the camera module
  • Imaging device packaging, camera module and the producing process of the camera module

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0089] FIG. 1 is a schematic diagram of a small-sized modular camera as a first embodiment of the present invention.

[0090] As shown in FIG. 1, for example, according to this embodiment of the present invention, the optical system is placed on the top surface of the ceramic plate, and the imaging device is provided on the lower surface thereof.

[0091] Incidentally, HTCC (high temperature cofired ceramics) or LTCC (low temperature cofired ceramics) is used for the ceramic plate. HTCC is a high temperature co-fired ceramic, which has the characteristics of providing high dielectric coefficient, and the processing accuracy is lower than LTCC, but the cost is lower. LTCC is a low-temperature co-fired ceramic, which has the characteristics of providing low resistance and no shrinkage compared with HTCC, and has good processing accuracy and low dielectric coefficient (suitable for high-frequency circuits).

[0092] LTCC or HTCC (hereinafter referred to as 'LTCC' collectively re...

no. 3 example

[0110] Fig. 3 is a schematic diagram of a small-sized module camera as a third embodiment of the present invention.

[0111] As shown in FIG. 3, for example, according to this embodiment of the present invention, the optical system and an imaging device are incorporated into the ceramic board, and the imaging device is provided on the lower surface of the ceramic board.

[0112] LTCC 26 is used for the board as shown in FIG. 2 .

[0113] A cylindrical through hole is provided in the LTCC 26 , which is equivalent to the optical system accommodating portion 27 for containing the IR cut filter 28 and the lens 21 . A threaded portion 26b is formed on the inner wall of the optical system accommodating portion 27 . A support portion 26 a for supporting the IR cut filter 28 and preventing the underfill 25 from flowing into the light receiving portion 23 of the imaging device 22 is formed at the boundary portion of the optical system accommodating portion 27 on the lower surface of t...

no. 4 example

[0128] 5 is a sectional view of a camera module as a fourth embodiment of the present invention. 6A to 6C illustrate the underfill flow preventing portion of FIG. 5 in detail.

[0129] A plastic or ceramic plate is used as plate 6 .

[0130] A through hole 5 is provided in the plate 6, and a stepped portion 5a is provided in an upper portion of the through hole 5. As shown in FIG. Like a ring around the through-hole 5 in the lower surface of the board 6 , a land 13 with a copper pattern as the base of the underfill flow preventing portion 16 is formed. Also, around the bonding pad 13 , a gold-plated solder bonding pad 6 a is formed for bare chip packaging of the imaging device 8 .

[0131] A protective layer 14 is applied on the annular land 13, and a screen printing layer 15 is formed on the protective layer 14 (in detail, as shown in FIG. 6A).

[0132] The underfill flow preventing portion 16 includes a land 13 , a protective layer 14 , and a screen printing layer 15 . T...

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Abstract

An IR cut-filter is fitted into a support portion within the optical-system containing portion of a ceramic board and a lens 11 is mounted in the ceramic board by screwing the lens. In an imaging-device containing portion, an imaging device with a light receiving portion arranged therein is mounted outside the support portion by flip-chip packaging. Further, the vicinity of the flip-chip packaging portion is sealed with resin. Additionally, on the base of the imaging-device containing portion of a ceramic package, the lands of an imaging device are so positioned as to correspond to the respective land positions of a ceramic package and patterns are electrically connected by melting a gold bump, whereby the imaging device is mounted by bare-chip packaging. The land portion is filled with an underfill agent and then sheet glass is mounted on a through-hole 5b and sealed with a sealing agent, so that the through-hole 5b for containing a light receiving portion is sealed up.

Description

technical field [0001] The present invention relates to an imaging device package for a portable communication device such as a mobile phone, a portable information terminal such as a PDA, a digital camera, etc.; and to a camera module and a camera using such a package; and to a camera Module production method. The present invention relates to a structure in which a bare semiconductor chip board such as a CCD imaging device is also mounted on a circuit board. Background technique [0002] A camera module included in a mobile phone such as a cellular phone is required to have a small size. So far, studies have been conducted mainly on reducing the size in the X-Y (plane) direction. However, as cellular phones are becoming more multifunctional, since liquid crystals in display units are replaced with EL elements, it is required to reduce the size and thickness of camera blocks. [0003] JP-A-2001-128072 discloses a camera module which is improved in its thickness. [0004]...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L31/0203H01L31/0232H04N5/225H05K1/02H05K3/32
CPCH01L27/14625H01L2224/29035H04N5/2254H01L2224/73204H01L2224/17051H01L31/0232H01L2224/14135H05K2201/09809H01L2224/29011H05K1/0219H01L27/14618H01L31/0203H05K2201/10977H05K2201/10719H01L2224/81191H04N5/2253H05K3/323H01L2224/05573H01L2224/05568H01L2924/00014H01L31/02325H04N23/54H04N23/57H04N23/55H01L2924/00012H01L2224/05599H01L27/146H04N25/00
Inventor 相泽充昭伊东裕树中井正信
Owner KYOCERA CORP