Lifting/lowering type substrate proless device and substrate process system having same

Abstract

The substrate treatment apparatus 10 includes a housing shape cover 11 having a substrate input port 11a and a substrate discharge port 11b provided in parallel in a vertical direction, and a treatment mechanism 20 mounted in the cover 11. The apparatus 10 further includes the treatment mechanism 20 having a conveying/supporting means for receiving and supporting the substrate conveyed from the input port 11a and discharging the substrate from the port 11b, a support substrate 21 for supporting the conveying/supporting means, a substrate inclining means for inclining the substrate supported by the conveying/supporting means, and a treatment fluid discharge means arranged above the substrate/supporting means to discharge a treatment fluid on the substrate inclined by the substrate inclining means, and a lifting means 40 for supporting the treatment mechanism 20, lifting the treatment mechanism 20 in a vertical direction and making the treatment mechanism 20 pass via the port 11a and the port 11b.

Description

technical field [0001] The present invention relates to a processing device and multi-connection device for performing predetermined processing on various substrates such as semiconductor (silicon) wafers, liquid crystal glass substrates, glass substrates for photomasks, substrates for optical discs, etc., while moving (transporting) them. A substrate processing system composed of a processing device. Background technique [0002] For example, in the manufacturing process of liquid crystal glass substrates, wet processing of coating of developing solution, coating of etchant, and coating of stripping liquid for stripping resist film is carried out, and cleaning is performed during each wet processing. Net treatment and dry treatment. [0003] In addition, as a processing apparatus used for each of the above-mentioned processings, a processing apparatus configured in such a manner that a substrate is placed on a conveying roller and passed through the conveying roller while ...

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Problems solved by technology

[0014] That is, for example, such as Figure 15 As in the example shown, if the substrate K is etched in the first processing unit 206 and then transferred without being cleaned, the degree of etching progress will be affected by the difference in the transfer time to the second processing unit 207. Different, cannot control etching with high precision

Since the substrate conveying unit 210 has a complicated operation mechanism consisting of a mechanism for raising and lowering the substrate K and a mechanism for moving the second conveying roller 216, it is difficult to control the conveying time with high precision.

[0015] In addition, for example, when the final process of the first processing unit 206 is a cleaning process, if the substrate K is conveyed without drying, dry spots or stains will occur on the surface, and the substrate K will become a defective product.

[0016] Furthermore, in the above-mentioned conventional substrate processing system 200, various processing liquids such as etching liquid and cleaning water are supplied to the substrate K while the substrate K in a

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