Production method for semiconductor chip

Abstract

A semiconductor wafer is applied to a support disk via an intervening adhesive layer with the front side of the semiconductor wafer facing the adhesive layer, which is sensitive to a certain exterior factor for reducing its adhesive force; the semiconductor wafer is ground on the rear side; the wafer-and-support combination is applied to a dicing adhesive tape with the so ground rear side facing the dicing adhesive tape, which is surrounded and supported by the circumference by a dicing frame; the certain exterior factor is effected on the intervening adhesive layer to reduce its adhesive force; and the intervening adhesive layer and support disk are removed from the semiconductor wafer or chips without the possibility of damaging the same.

Description

technical field [0001] The present invention relates to a method of manufacturing a semiconductor chip by grinding while supporting a semiconductor wafer using a plate support member. technical background [0002] On a semiconductor wafer, a plurality of circuits such as ICs and LSIs are formed, and are divided into individual semiconductor chips by dicing along the dividing lines on the surface, which are used in various electronic devices. [0003] The back surface of the semiconductor wafer is ground to form the required thickness. In recent years, since the miniaturization and weight reduction of electronic equipment has become possible, the semiconductor wafer is also required to be processed very thin, so that the thickness is less than 100 μm and less than 50 μm. However, the thinned semiconductor wafer is as soft as paper, and handling after grinding is difficult. Therefore, efforts have been made to perform polishing in a state where the semiconductor wafer is atta...

AI Technical Summary

Problems solved by technology

[0005] In addition, prefabricated cutting grooves are formed on the dividing roads on the surface of the semiconductor wafer. In the method of dividing individual semiconductor chips by grinding the back surface until the cutting grooves appear, it is called the so-called pre-dicing method. Paste the semiconductor wafer with cut grooves formed on the rigid plate support member before grinding, and extract the divided semiconductor chips from the plate support member after grinding without damaging the thin Semiconductor chip, it is also difficult to peel it off from the plate support member

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