Method of manufacturing medium density fiber board thick plate using spray evaporation-vacuum hot pressing technology
A vacuum hot-pressing and medium-density technology, which is applied to flat products, wood processing appliances, household components, etc., can solve problems such as prolonging hot-pressing time and reducing product quality, and achieves small cross-sectional density distribution deviation and internal bonding strength. The effect of improving and reducing free formaldehyde
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
example 1
[0012] Example 1: Compression thickness 20mm, density 0.70g / cm 3 The medium density fiberboard adopts spray steaming-vacuum hot pressing process, and its technical parameters are: the slab is first compressed to 0.3g / cm 3 , and then spray steam the slab, the steam spray time is about 3s, the steam pressure is 0.3Mpa, after 2min, vacuum the slab, the suction time is 6s.
example 2
[0013] Example 2: Press thickness 30mm, density 0.65g / cm 3 The medium density fiberboard adopts spray steaming-vacuum hot pressing process, and its technical parameters are: the slab is first compressed to 0.35g / cm 3 , and then spray steam the slab, the spray steam time is about 8s, the steam pressure is 0.5Mpa, after 6min, the slab is vacuum-suctioned, and the suction time is 8s.
example 3
[0014] Example 3: Pressing thickness 40mm, density 0.60g / cm 3 The medium density fiberboard adopts spray steaming-vacuum hot pressing process, and its technical parameters are: the slab is first compressed to 0.35g / cm 3 , and then spray steam the slab, the steam spray time is about 15s, the steam pressure is 0.8Mpa, after 8min, the slab is vacuumed, the suction time is 15s.
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com