High property passive cooling device with conduit

Abstract

A passive cooling device 10 for removing waste heat from a component 50 is disclosed. The passive cooling device 10 includes a heat mass 11 and a stem 13 extending outward therefrom and including a plurality of fins 24 with stem slots SS therebetween. A plurality of vanes 21 that include fins 23 formed therein surround the stem 13 and define a chamber 30. A duct 90 connects with a top face 29 of the vanes 21 and an air flow source 70 that generates an air flow F through the chamber 30, the stem fins 24, the fins 23, and the vanes 21 to dissipate heat from the heat mass 11. The air flow source 70 can supply a positive FP or a negative FN air flow.

Description

technical field [0001] The present invention generally relates to a passive cooling device for dissipating heat from components to which it is connected. More specifically, the present invention relates to a passive cooling device for dissipating heat from components connected thereto, and including conduits for directing an air flow between a source of air flow and the passive cooling device. Background technique [0002] In the field of electronic devices, it is known to bring a heat sink and the electronic device into contact so that waste heat generated by the operation of the electronic device is thermally transferred to the heat sink, thereby cooling the electronic device. With the advent of high clock speed electronic devices such as microprocessors (μP), digital signal processors (DPS) and application specific integrated circuits (ASICs), the amount of waste heat generated by these electronic devices and the operating temperature of these electronic devices Proporti...

AI Technical Summary

Problems solved by technology

[0006] Increasing the size of the fan and heatsink has some disadvantages

First, if the size of the heatsink increases vertically (i.e., in the direction perpendicular to the PC board), the heatsink is taller, making it impossible to fit in the vertical space in many applications, such as in the case of a desktop computer

Second, if the PC board has a vertical orientation, a tall and heavy heatsink may mechanically stress the PC board and / or electronics, resulting in failure of the device or PC board

Fifth, when a heat sink has a cylindrical shape composed of cooling fins, usually several such heat sinks cannot be installed close to each other, because the airflow in and out of the cooling fins will be blocked by adjacent heat sinks, thus reducing the cooling efficiency. reduce

In each case, the result was a fan failure

Fifth, glue is generally used to install the fan on the radiator, and the glue can enter the fan and cause the fan to fail

Either of the above failure modes can lead to the failure of the electronics that the heatsink is designed to cool, as the air circulation created by the fan is critical to efficiently dissipate waste heat from the electronics

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