Power miniature assembly and its mfg. method
A technology of micro-components and manufacturing methods, which is applied in the fields of printed circuit manufacturing, electrical components, and electric solid-state devices. It can solve problems such as prolonged research and development time, increased production costs, and delays in product listing, and achieves accelerated research and development speed and excellent heat dissipation performance. , Reduce the effect of contact thermal resistance
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Embodiment 1
[0066] use figure 1 The power micromodule of Embodiment 1 will be described.
[0067] figure 1 It is a cross-sectional view showing the structure of the power micromodule in Embodiment 1 of the present invention. exist figure 1 Among them, 107 is the power micro-component according to Embodiment 1 of the present invention. The power micromodule 107 has: a multilayer base plate 101 with through-holes 102 , electronic components 103 (each having arbitrarily different heights) to dissipate heat, a heat sink 104 , highly thermally conductive components 105 , electronic components 106 .
[0068] The power micromodule of this embodiment is composed of a multilayer bottom plate 101 , a high thermal conductivity component 105 , and a heat sink 1043 layers. In the multilayer substrate 101, electronic components 103, 106 are mounted on an insulating substrate 101b. Electronic components 103 to dissipate heat, such as power conversion circuits using power semiconductor elements o...
Embodiment 2
[0082] The power micromodule of the second embodiment will be described with reference to FIG. 2 .
[0083]Fig. 2 is a cross-sectional view showing the structure of a power micromodule according to Embodiment 2 of the present invention. In FIG. 2 , 207 is the power micro-component of the second embodiment. The power micromodule 207 of the present embodiment has: a multi-layer base plate 101 with a through hole 102, electronic components 103 to dissipate heat (with arbitrary different heights), a radiator 104, a high thermal conductivity member 105, and an electronic component 106.
[0084] The difference between the power micro-assembly of Embodiment 2 and Embodiment 1 is that the high thermal conductivity member 105 is made into the surface of the electronic component 103 to be dissipated, only a part is buried in the member 105, and the high thermal conductivity member 105 and the multilayer base plate 101 Set the gap between the surfaces at this point. The high thermal co...
Embodiment 3
[0090] use image 3 The power micromodule of the third embodiment will be described.
[0091] image 3 It is a sectional view showing the structure of the power micromodule according to Embodiment 3 of the present invention. image 3 Among them, 307 is the power micro-component of this embodiment. The power micromodule 307 of the third embodiment has: a multilayer base plate 101 with through holes 102, electronic components 103 (respectively having arbitrary heights) to dissipate heat, a heat sink 104, components 105 with high thermal conductivity, and electronic components 106.
[0092] The difference between the power micromodule of this embodiment and the first embodiment is that the radiator 104 is concave, and the radiator 104 surrounds (buries) the high thermal conductivity member 105 of the electronic component 103 to be dissipated. With such a structure, the heat emitted from the component 103 to be dissipated is efficiently transferred to the heat sink 104 . The o...
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