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Method of resin encapsulation, apparatus for resin encapsulation, method of manufacturing semiconductor device and resin material

A technology of resin encapsulation and resin materials, applied in semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., can solve problems such as voids, resin curing, and resin waste

Inactive Publication Date: 2004-06-09
TOWA +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the above-mentioned problems of generation of voids or unfilled portions are prone to occur
[0009] In addition, sometimes the resin solidifies in the resin flow path, and the resin cured in the resin flow path is discarded
Therefore, the conventional resin encapsulation method would waste resin material

Method used

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  • Method of resin encapsulation, apparatus for resin encapsulation, method of manufacturing semiconductor device and resin material
  • Method of resin encapsulation, apparatus for resin encapsulation, method of manufacturing semiconductor device and resin material
  • Method of resin encapsulation, apparatus for resin encapsulation, method of manufacturing semiconductor device and resin material

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Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0040] refer to Figure 1A ~ Figure 3B The resin sealing method of Embodiment 1 will be described.

[0041] Such as Figure 1A and Figure 1B As shown, in the resin encapsulation device used in the resin encapsulation method of this embodiment, a metal mold pair in which a lower mold 1 and an upper mold 2 face each other is provided. In addition, a pressurizing device (not shown) for closing and opening the lower mold 1 and the upper mold 2 is provided in the resin packaging device.

[0042] Figure 1A It shows the state where the conveyance unit 3 is installed in the space between the lower mold 1 and the upper mold 2 . The transfer unit 3 is in a state of being inserted into the space between the lower mold 1 and the upper mold 2 by the function of a driving device not shown. The transfer unit 3 can be transferred from the space between the lower mold 1 and the upper mold 2 to the outside by utilizing the function of the driving device. In addition, the resin material 4 ...

Embodiment approach 2

[0063] Below, refer to Figure 4A ~ Figure 5B The resin sealing method of Embodiment 2 will be described. Figure 4A ~ Figure 5B The structure of the resin sealing device of this embodiment is shown. Figure 4A ~ Figure 5B in and adopted Figure 1A ~ Figure 3B Components having the same names as the components of the resin sealing device according to Embodiment 1 described above have the same functions as those described in Embodiment 1, and therefore descriptions of the functions of these components will not be repeated.

[0064] Such as Figure 4A ~ Figure 5B As shown, in the resin sealing device of this embodiment, the substrate 14 is placed on the lower mold 21 , and the resin material 22 is placed on the substrate 14 . The resin material 22 has a size and shape corresponding to the size and shape of a cavity (described later) provided in the upper mold 25 . In addition, the resin material 22 is composed of a flat plate portion 23 and an edge portion 24 . Such as Fi...

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Abstract

First, a board is placed on a board mounting portion with a lower mold and an upper mold being opened. Then, a resin material having such size and shape that correspond to the size and shape of a cavity formed in the lower mold is fitted in the cavity. Thereafter, the resin material is heated resulting in melted resin. Thereafter, the lower mold and the upper mold are closed, with a space formed by the upper mold and the lower mold being reduced in pressure. As a result, chips and wires are immersed in the melted resin. Thereafter, the melted resin is set, so that a resin mold product including the board and the set resin is formed.

Description

technical field [0001] The present invention relates to a resin encapsulation method and the like for encapsulating electronic components on a substrate. Background technique [0002] A conventional resin encapsulation method used when manufacturing a semiconductor package as an example of a resin molded product in which electronic components are mounted on a substrate will be briefly described. [0003] In the conventional resin encapsulation method, first, a printed wiring board (hereinafter simply referred to as a substrate) mounted with a semiconductor chip (hereinafter simply referred to as a chip) as an electronic component is prepared. Then, the substrate is mounted on one of the mold pairs formed by opposing one mold and the other mold, and the mold pair is closed. Next, molten resin is injected into a cavity provided in the other metal mold of the pair of metal molds through a resin flow path. At this time, the molten resin is pressurized. [0004] Then, the inje...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/02H01L21/56
CPCH01L24/97H01L2924/01005H01L2924/01033H01L2924/01006H01L2924/01029H01L2924/01082H01L2224/48091H01L2224/97H01L2924/01068H01L21/565H01L2224/48227H01L2924/15787H01L2924/181H01L2924/00014H01L2224/85H01L2924/00H01L23/02
Inventor 浦上浩中川长藤野欣也高濑慎二德山秀树目黑弘一西野徹早坂昇
Owner TOWA
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