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Fluid jetting head structure and its making process

A nozzle hole and print head technology, which is applied in the field of fluid ejection head structure and its manufacturing, can solve the problems of large chip size, uneconomic benefits, and the part of the chip that cannot be used in any way, so as to enhance the strength and reduce the size of the chip Size, the effect of increasing the printing speed

Inactive Publication Date: 2004-11-24
YOSHIKUNI HLDG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] However, using this method not only requires a relatively large chip size, but also the excavated part of the chip cannot be used in any way, which is very uneconomical.

Method used

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  • Fluid jetting head structure and its making process
  • Fluid jetting head structure and its making process
  • Fluid jetting head structure and its making process

Examples

Experimental program
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Embodiment Construction

[0017] See figure 1 , figure 1 It is a cross-sectional view of the structure of the fluid ejection head of the present invention. The fluid ejection head of the present invention is a fluid ejection device with a virtual valve. Such as figure 1 As shown, the bubble generator includes two bubble generating components, respectively a first heating assembly 14a and a second heating assembly 14b, which surround the nozzle hole (nozzle) 12. The difference between the two heating assemblies 14a, 14b, For example, the difference in resistance value may cause two air bubbles to be generated successively when the two heating elements 14a, 14b are heated. First, a first air bubble (not shown) is formed at the first heating element 14a next to the nozzle hole 12, which is close to the manifold (manifold) 11. This first bubble will isolate the manifold 11 from the nozzle hole 12, and generate similar gas The function of the valve is to reduce the effect of cross talk with the adjacent...

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Abstract

The fluid jetting head structure is formed on one substrate, and includes at least one manifold branch, at least one bubble generator and one conducting circuit as well as at least two rows of fluid cavities connected to the manifold branch and on two sides of the manifold branch. The conducting circuit is set partially on the surface of the substrate over the manifold branch and partially between two rows of fluid cavities to drive the bubble generator.

Description

[0001] The present invention is a divisional application of the original invention patent application (application number: 01143335.3, application date: December 20, 2001, invention name: fluid ejection head structure and manufacturing method thereof). technical field [0002] The invention relates to a structure of a fluid ejection head and a manufacturing method thereof, in particular to a structure of a fluid ejection head utilizing electric force line layout between two rows of bubble generators and a manufacturing method thereof. Background technique [0003] At present, fluid ejection devices have been widely used in equipment such as inkjet heads of inkjet printers, and with the continuous improvement of reliability (reliability) of fluid ejection devices, the significant reduction in cost, and the ability to provide high frequency ) and the development of high-quality droplet ejection with high spatial resolution, fluid ejection devices are gradually having many other...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B41J2/05B41J2/16
Inventor 黄宗伟陈志清
Owner YOSHIKUNI HLDG