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Method for connecting conductor and solder and electronic element in said connecting method

An electronic component and connection method technology, which is applied to the connection between conductors and solder and the field of electronic components using this connection, can solve the problems of increased processing cost, tin ablation, and electronic components cannot be electrically connected to the circuit board. Simple processing and good electrical conduction effect

Inactive Publication Date: 2004-12-15
DEYI PRECISION ELECTRONIC IND CO LTD PANYU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this electronic component has the following defects: first, because the heating and welding needs to adopt a reflow furnace, the process is complicated and time-consuming, which will seriously affect the productivity and increase the processing cost; The opportunity to dissolve air impurities in the place will reduce the conductive quality and welding strength of the welding place, which will lead to tin collapse when the solder ball is welded to the circuit board, resulting in the electronic components not being able to effectively conduct electricity with the circuit board

Method used

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  • Method for connecting conductor and solder and electronic element in said connecting method
  • Method for connecting conductor and solder and electronic element in said connecting method
  • Method for connecting conductor and solder and electronic element in said connecting method

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Embodiment Construction

[0016] Such as figure 1 , figure 2 , image 3 As shown, the electronic component of the present invention includes an insulating body 10 and a plurality of conductors 20 and solder balls 30 accommodated in the insulating body 10. The conductor 20 has a fixing portion 21 fixed in the insulating body 10, and the fixing portion 21 The welding part 22 extending downward, and the elastic arm 23 extending vertically from one side of the fixing part 21, the lower end of the elastic arm 23 is vertically bent into a horizontal shape to form a connecting part 24 to connect with the solder ball 30, and the upper end passes through The terminal is bent multiple times to form a contact portion 25 with certain elasticity, so as to elastically compress and contact with the lead portion (not shown in the figure) of the docking electronic component.

[0017] When assembling, first coat (other installation methods such as dots and stickers) on the bottom of the conductor connection part 24 e...

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Abstract

This invention discloses a connection method for a electric conductor and a solder which is stuck on the conductor or an insulation body containing the conductor by adhesives, then to heat the solder to be melted to solder the conductor and the butt-joint electronic elements including the insulation body and several conductors and solders in the insulation body, adhesives are put between the tin sweat and conductor or the insulation body for fixing them.

Description

technical field [0001] The invention relates to a connection method of a conductor and solder and an electronic component using the connection method. Background technique [0002] At present, many electronic components, such as CPU socket connectors, board-to-board electrical connectors, etc., use BGA (ball grid array, ball grid array) to directly bond them to the circuit board by using surface bonding technology. . The electronic component includes an insulating body and a plurality of conductors and tin balls accommodated in the insulating body. The conductors and tin balls are welded together in advance. This electronic component is assembled as follows: first insert the conductor into the insulating body, then stick the tin ball to the bottom of the conductor, and then solder the tin ball to the conductor by heating. However, this electronic component has the following defects: first, because the heating and welding needs to adopt a reflow furnace, the process is comp...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/24
Inventor 张文昌
Owner DEYI PRECISION ELECTRONIC IND CO LTD PANYU
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