Method for connecting conductor and solder and electronic element in said connecting method

An electronic component and connection method technology, which is applied to the connection between conductors and solder and the field of electronic components using this connection, can solve the problems of increased processing cost, tin ablation, and electronic components cannot be electrically connected to the circuit board. Simple processing and good electrical conduction effect
CN1555216AInactive Publication Date: 2004-12-15DEYI PRECISION ELECTRONIC IND CO LTD PANYU
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Patent Information

Authority / Receiving Office
CN ยท China
Patent Type
Applications(China)
Current Assignee / Owner
DEYI PRECISION ELECTRONIC IND CO LTD PANYU
Publication Date
2004-12-15
Estimated Expiration
Not applicable ยท inactive patent

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Abstract

This invention discloses a connection method for a electric conductor and a solder which is stuck on the conductor or an insulation body containing the conductor by adhesives, then to heat the solder to be melted to solder the conductor and the butt-joint electronic elements including the insulation body and several conductors and solders in the insulation body, adhesives are put between the tin sweat and conductor or the insulation body for fixing them.
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Description

technical field

[0001] The invention relates to a connection method of a conductor and solder and an electronic component using the connection method. Background technique

[0002] At present, many electronic components, such as CPU socket connectors, board-to-board electrical connectors, etc., use BGA (ball grid array, ball grid array) to directly bond them to the circuit board by using surface bonding technology. . The electronic component includes an insulating body and a plurality of conductors and tin balls accommodated in the insulating body. The conductors and tin balls are welded together in advance. This electronic component is assembled as follows: first insert the conductor into the insulating body, then stick the tin ball to the bottom of the conductor, and then solder the tin ball to the conductor by heating. However, this electronic component has the following defects: first, because the heating and welding needs to adopt a reflow furnace, the process is comp...

Claims

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