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Eutectic alloy for spraying electronic component and its making method

A production method and technology of electronic components, applied in the direction of coating, fusion spraying, metal material coating process, etc., can solve the problems of health hazards for operators, high melting point of materials, environmental pollution, etc., to protect human health, melting point Low, the effect of improving working conditions

Inactive Publication Date: 2005-01-26
李建仲
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  • Summary
  • Abstract
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  • Claims
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Problems solved by technology

Although this kind of material has the characteristics of wide source of raw materials, low cost, and relatively simple production process, but because its main component is lead, it will bring serious pollution to the environment both in the production process and in the use process. , causing harm to the health of the operators, the company will spend a lot of money on pollution prevention and control and regular lead discharge treatment and recuperation for the operators every year. In addition, this material has a high melting point, and the energy consumption in the process of production and use is also relatively high. high

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0012] This embodiment is example with melting 10kg alloy wire:

[0013] 1. Prepare materials: divide tin ingots with a purity of 99.99%, zinc blocks with a purity of more than 99.0%, 240-mesh antimony powder and copper powder, bismuth and cadmium into 4.5kg of tin ingots, 2.0kg of zinc blocks, 2.0kg of bismuth, and cadmium 1.4kg, 90g of antimony powder and 10g of copper powder are weighed separately for use;

[0014] 2. Smelting: First, place the zinc block to be weighed and melted in a graphite crucible boiler, then add 90g of antimony powder when heating to 600°C, and add 10g of copper powder when heating to 800°C, and wait for the copper powder to Melt and evenly melt with zinc and antimony, then add 4.5kg of tin ingot, 2.0kg of bismuth, and 1.4kg of cadmium, remove the surface scum after all the melting is uniform, and the whole melting process is carried out under stirring;

[0015] 3. Casting and forming: inject the above-mentioned molten liquid after removing scum int...

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Abstract

The invention provides a eutectic alloy for electronic element surface spray coating and its preparing method. The alloy consists of Sn, Zn, Pb, Cu, and Bi or Cd and is prepared by smelting in proportion. The preparing process comprises: preparing the materials according to the proportion, smelting, cast forming, hot extrusion, and bright drawing. In the invention, the lead is replaced with Bi or / and Cd and Sb, which can reduce the lead pollution.

Description

technical field [0001] The invention belongs to the low-melting-point alloy material and its production method in electronic component spraying materials, in particular to a eutectic alloy material for spraying (also known as gold-spraying material) which does not contain harmful element lead. The gold-spraying material is especially suitable for It is used as a material for spraying (plating) treatment on the surface of electronic components such as polyester film capacitors. Background technique [0002] The low-melting-point metal-spraying gold material commonly used for spraying the surface of electronic components such as polyester film capacitors is mainly composed of lead, which is smelted together by adding tin, zinc and other elements. For example, the special gold spraying material for capacitors produced by Guangzhou Qingyuan Electronic Plating Material Factory belongs to this type of material. Although this kind of material has the characteristics of wide source...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C30/06C23C4/08
Inventor 李建仲
Owner 李建仲
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