Two degrees of freedom moving planar parallel mechanism
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- GUANGDONG UNIV OF TECH
- Publication Date
- 2005-06-22
- Estimated Expiration
- Not applicable · inactive patent
Smart Images
Figure 1
Abstract
Description
technical field
[0001] The invention belongs to the field of industrial robots, and in particular relates to a two-degree-of-freedom moving plane parallel mechanism, which is especially suitable for a welding head mechanism of a wafer bonding machine, a key equipment of a semiconductor post-process production line. Background technique
[0002] The parallel mechanism is a closed-loop kinematic system composed of multiple parallel chains, that is, one end of multiple kinematic chains is connected to a terminal operator with multiple degrees of freedom at the same time. The parallel mechanism has the following advantages: high stiffness-to-weight ratio; high load-to-weight ratio; small error and high precision; it is easy to place the drive motor on the machine base, which reduces the motion load and can move at high speed; in position solving , the reverse solution of the parallel mechanism is easy; the structure is simple and the degree of modularization is high.
[0003] I...