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Sn ball flatening method

A solder ball and leveling technology, applied in the manufacture of electrical components, electrical solid devices, semiconductor/solid devices, etc., can solve problems such as empty soldering, affecting the normal operation of products, and deformation of the insulating body 11, so as to ensure the welding effect and good Welding effect, simple operation effect

Inactive Publication Date: 2005-08-10
DEYI PRECISION ELECTRONIC IND CO LTD PANYU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, deformation of the insulating body 11 will inevitably occur during the molding process (such as figure 1 ), resulting in some solder balls 10 failing to form a flat coplanar surface with the circuit board when soldering with the circuit board 3, resulting in empty soldering, which seriously affects the normal operation of the product

Method used

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  • Sn ball flatening method
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Examples

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Embodiment Construction

[0012] Such as figure 2 , 3 As shown, the solder ball leveling method of the present invention is to level the solder ball 10 (certainly, it can also be a solder post or other forms of solid solder) at the bottom of the electronic component 1, so that the bottom of the solder ball 10 has a higher coplanarity. Spend. The method includes: providing a pressing block 2, at least one surface 20 of the pressing block 2 is flat; facing the flat plane 20 on the pressing block 2 to the bottom surface of the solder ball 10, and pressing the pressing block 2 against the solder ball 10, so that the higher Deformation of the bottom of solder ball 10 (the higher the protrusion, the greater the deformation, such as Figure 4 ), finally ensure that the bottom surface of each solder ball 10 has a higher flatness.

[0013] After implementing the above method, the bottom surface of the solder ball 10 on the electronic component 1 has a relatively high flatness, so that it can produce good co...

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Abstract

The disclosed method for flattening solid solder on electronic module includes following steps: providing a pressed block, which has at least one flattening surface; the flattening surface of the pressed block faces to underside of solid solder; pushing the pressed block against solid solder to make it flattening. The method is simple. Favorable soldering effect is guaranteed between flattened tin balls on electronic module and circuit board.

Description

【Technical field】 [0001] The invention relates to a solder ball leveling method, in particular to a solder ball leveling method of an electronic component. 【Background technique】 [0002] At present, electronic components, especially electrical connectors and chips, due to the intensive wiring requirements, therefore, electrical connectors and chips are changed from DIP soldering method to SMT method, and further developed into BGA (solder ball grid array) method. . However, because the insulating body 11 will inevitably be deformed during the molding process (such as figure 1 ), resulting in some solder balls 10 failing to form a flat coplanar surface with the circuit board when soldering with the circuit board 3, resulting in empty soldering, which seriously affects the normal operation of the product. [0003] Therefore, there is an urgent need for a solder ball leveling method to level the solder balls on the electronic components to ensure the normal operation of the ...

Claims

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Application Information

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IPC IPC(8): H01L21/00H01L21/28H01L21/44H01L21/60H01L23/48H05K3/34
Inventor 朱德祥
Owner DEYI PRECISION ELECTRONIC IND CO LTD PANYU