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Light-emitting diode arrangement and method for making same

A technology of light-emitting diodes and manufacturing methods, applied in the direction of electrical components, electrical solid devices, circuits, etc., capable of solving problems such as not being prompted or suggested

Inactive Publication Date: 2005-08-17
翁世杰 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

These issues are not suggested or suggested in the above-mentioned patent cases

Method used

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  • Light-emitting diode arrangement and method for making same
  • Light-emitting diode arrangement and method for making same
  • Light-emitting diode arrangement and method for making same

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Embodiment Construction

[0038] The present invention will be described in further detail below in conjunction with accompanying drawing:

[0039] Such as figure 1 , figure 2 As shown, the structure of the light emitting diode of the present invention has a model body 10, and this model body 10 includes a central part 12 for fixing the cup holder 11 of the chip 30, which is defined as the cathode end, and a connection with the anode end. The joint portion 14 of the foot unit 141 ; basically, the foot unit 141 is used to wear and fit on the circuit board to establish the combined state of the finished LED and the circuit board. see you again figure 1 , and its phantom line part simultaneously shows a light-emitting diode finished product combined with the model body 10 of the present invention; a chip 30 can be fixed in the cup holder 11 of the central part 12, and allows two ends of the wire 40 to be respectively connected to the chip 30 and junction 14. Then, install a light-transmitting body 50...

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PUM

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Abstract

This invention discloses a luminescent diode structure and its process method, which comprises the following steps: on one production line providing one metal flat stock materials through one upper and down modules continuous rolling operations to form one mold, wherein the mold has one stock socket central part to fix chips named as cathode end and one rigid wall with several rib and paddy parts along the outside edges direction to the central part with one groove chamber or chamber room; providing one rolling program to form one grid structure on the flat stock and the connection leg units and bonding part named as anode end to together make the mode establish larger area of heat dissipation surface.

Description

technical field [0001] The invention relates to the field of light-emitting diodes, in particular to a structure capable of significantly improving the heat dissipation function of light-emitting diodes and a manufacturing method thereof. Background technique [0002] Now, light-emitting diodes (LEDs) have been widely used in various electronic product systems; from indicator lights with weak luminous efficiency, to high-intensity information products, outdoor billboards, traffic signs and other lighting fixtures. Basically, it uses a 60N interface that operates in a forward bias. When the forward bias is applied, a large number of holes are injected in the 60-type region, and a large number of electrons are injected in the N-type region. These holes and The electrons will inject minority carriers into the other region in the depletion region, and at the moment of combining with a large number of carriers there, the radiation emits photons equivalent to the energy of the ene...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L29/24H01L33/54H01L33/62H01L33/64
CPCH01L33/642H01L2924/0002H01L33/54H01L33/647H01L33/62H01L2924/00
Inventor 翁世杰于凯任
Owner 翁世杰