Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method for realizing regional grid points in PCB design

An implementation method and grid point technology, applied in the electronic field, can solve the problems of cumbersome grid system implementation, low PCB design accuracy and design efficiency, and grid point not being widely used, so as to reduce work intensity, improve efficiency, The effect of improving quality

Inactive Publication Date: 2005-09-14
HUAWEI TECH CO LTD
View PDF0 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It is not difficult to see that the cumbersomeness of the grid point system provided by the existing PCB design tools has led to the fact that the grid point has not been widely used, which in turn leads to low accuracy and design efficiency of PCB design.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for realizing regional grid points in PCB design

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0034] The core of the present invention is to provide an effective grid point layout method for PCB design tools, so that different areas can be provided with grid points required for design during the PCB design process, and different areas correspond to different grid point layout methods. For example, a 1MM BGA provides 0.5MM grid points, and a 1.27MM BGA provides 25mil grid points, etc.; in this way, CAD engineers only need to complete the grid point setting once, and there is no need for frequent grid point setting in future designs. set up.

[0035] In a nutshell, the present invention sets different grid points for different areas, and can be divided into two situations in the process of grid point arrangement for each area: one is to use different grid points corresponding to different areas At the same time, it is arranged in the PCB design file. When the PCB designer switches and designs in different areas, there is no need to perform grid layout operations; the oth...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a realization method of region grid point in PCB design. The invention sets different grid points for different regions at only one time in PCB design process. It also provides an implementation method of regionization arrangement of grid point so that in the process of PCB design, no matter how frequent it is to switch among different regions, design that is based at different grid point is convenient. The invention largely enhances efficiency of PCB design.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to a method for realizing regional grid points in PCB (printed circuit board) design. Background technique [0002] With the development of electronic technology and the needs of PCB design, various PCB design tools are continuously provided to PCB designers. [0003] In the process of PCB design, in order to improve the accuracy and efficiency of design, it is usually necessary to provide corresponding grid points in the area of ​​PCB design as a reference for PCB design. That is to say, during the PCB design process, a large number of various types of devices may be included in one area of ​​the PCB file page, and different grid support is required for the design of each type of device to efficiently complete the design. For example, 1MM BGA (Ball Grid Array) needs 0.5MM grid points, 1.27MM BGA needs 25mil grid points, etc. Usually, a PCB needs at least four or five types of ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G06F17/50
Inventor 李广生
Owner HUAWEI TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com