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Fluid jetting device and production method thereof

A technology of fluid injection and manufacturing methods, which is applied in printing and other directions, and can solve the problem that the surface properties of the metal layer are not enough to meet the needs of fluid injection devices.

Inactive Publication Date: 2005-11-02
BENQ CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the surface properties of metal layers are not sufficient to meet the needs of fluid ejection devices

Method used

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  • Fluid jetting device and production method thereof
  • Fluid jetting device and production method thereof
  • Fluid jetting device and production method thereof

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0028] refer to figure 2 , which shows the first embodiment of the fluid ejection device of the present invention, the fluid ejection device 100 of this embodiment includes a substrate 110, has a fluid cavity 113, a structural layer 112, and at least one bubble generating device 120 corresponds to the fluid cavity 113 And a protective layer 130 is arranged on the structural layer 112 and covers the air bubble generating device 120; a composite layer with hydrophobic and heat dissipation properties includes a metal layer 140 on the substrate 110 and a hydrophobic thick film layer 150 on the on the metal layer 140 ; ​​and an injection hole 114 adjacent to the bubble generating device 120 and penetrating the hydrophobic thick film layer 150 , the metal layer 140 , the protective layer 130 and the structural layer 112 to communicate with the fluid cavity 113 .

[0029] The base material 110 includes a silicon base 111 and a structural layer 112 disposed on the silicon base 111 an...

no. 2 example

[0044] Figures 4A-4E It is a schematic diagram of the second embodiment of the fluid injection device of the present invention. The substrate 110 provided in this embodiment includes a silicon substrate 111 and a structural layer 112, which are arranged on the silicon substrate 111; at least one bubble generating device 120 , disposed on the structural layer 112 ; and a protective layer 130 disposed on the structural layer 112 and covering the bubble generating device 120 . It is constituted in that the implementation steps are the same as those of the first embodiment (such as Figure 3A-3B ), whose description is omitted here.

[0045] see Figure 4A , forming an initial layer 140 a on the substrate 110 . The material of the initial layer 140a can provide sufficient adhesion between the metal layer and the protection layer.

[0046] see Figure 4B , forming a patterned photoresist layer 142 on the seed layer 140a and adjacent to the bubble generating device 120 by a li...

no. 3 example

[0053] Figures 5A-5C It is a schematic diagram of a third embodiment of the fluid ejection device of the present invention. The substrate 110 provided in this embodiment includes a silicon substrate 111 and a structural layer 112 disposed on the silicon substrate 111 . At least one bubble generating device 120 is disposed on the structural layer 112 . And a protective layer 130 is disposed on the structural layer 112 and covers the air bubble generating device 120 . It is constituted in that the implementation steps are the same as those of the first embodiment (such as Figure 3A-3B ), whose description is omitted here.

[0054] see Figure 5A , forming an initial layer 140 a on the substrate 110 . The material of the initial layer 140a can provide sufficient adhesion between the metal layer and the protection layer. This step is the same as Figure 4A same.

[0055] see Figure 5B , forming a hydrophobic thick film layer (such as a polymer layer) 150 on the initial ...

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Abstract

The present invention provides one kind of fluid jet device and its making process. The fluid jet device includes one base material unit comprising one fluid cavity, one structure layer, at least one bubble generator corresponding to the fluid cavity and one protecting layer on the structure layer to cover the bubble generator; one hydrophobic and heat dissipating composite layer on the base material unit comprising at least one metal layer and one hydrophobic thick film layer; and one jet hole adjacent to the bubble generator penetrating the composite layer, the protecting layer and structure layer to communicate with the fluid cavity.

Description

technical field [0001] The invention relates to a fluid injection device and a manufacturing method thereof, in particular to a fluid injection device capable of improving service efficiency and prolonging life and a manufacturing method thereof. Background technique [0002] At present, fluid ejection devices are mostly used in components such as inkjet heads and fuel injectors, among which inkjet heads are mostly designed with heat-trapping bubbles. [0003] figure 1 A monolithic fluid ejection device 1 of existing US Patent No. 6,102,530 is shown, which uses a silicon substrate 10 as a body, and forms a structural layer 12 on the silicon substrate 10, and between the silicon substrate 10 and the structural layer 12 A fluid cavity 14 is formed to accommodate a fluid 26; and a first heater 20 and a second heater 22 are arranged on the structural layer 12, and the first heater 20 is used to generate a first bubble in the fluid cavity 14 30 , the second heater 22 is used to...

Claims

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Application Information

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IPC IPC(8): B41J2/05
Inventor 陈苇霖胡宏盛
Owner BENQ CORP
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