Semiconductor laser assembly

A technology of laser diodes and heat sinks, applied in lasers, laser parts, semiconductor lasers, etc., can solve problems such as unfavorable laser characteristics and effects, and achieve the effect of improving contact performance
CN1692535AInactive Publication Date: 2005-11-02SONY CORP
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Patent Information

Authority / Receiving Office
CN Β· China
Current Assignee / Owner
SONY CORP
Publication Date
2005-11-02
Estimated Expiration
Not applicable Β· inactive patent

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Abstract

To prevent spherical solder residue from being formed on a semiconductor laser element, sub-mount or heat sink when producing a semiconductor laser assembly. A sub-mount (16) is provided with a sub-mount groove (32) formed along the boundary of a junction area thereof with a semiconductor laser element (12), and an extension groove (36) extending up to the edge of the sub-mount (16). A plurality of sub-mount slender grooves (38) each smaller in groove width and shallower in groove depth than the sub-mount groove (32) are formed in the sub-mount junction area in a lattice form and obliquely with respect to the sub-mount groove (32) so as to be separated from each other and communicate with the sub-mount groove (32) at at least one of each end. When the semiconductor laser element (12) is to be solder-joined, excessive solder flows out to the sub-mount (32) via sub-mount slender grooves (38) and then is discharged to the outside via an extension groove (36).
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Description

technical field

[0001] The present invention relates to a laser diode device having a structure that, when welding a laser diode device to a heat sink, there is a base therebetween, or welding is performed directly.

[0002] Specifically, the present invention relates to a laser diode device including a structure in which overflow of solder in a solder soldering surface between a laser diode device and a submount or a heat sink is suppressed, and the overflow solder does not Globs of solder residue form on laser diode devices, submounts, or heat sinks. Background technique

[0003] In a laser diode device, when converting electrical energy into light energy, energy losses are emitted, and this energy loss is converted into heat energy. This thermal energy increases the temperature of the laser diode and has an adverse effect on the laser properties.

[0004] In order to instantly diffuse the thermal energy generated in the laser diode device and enhance the mechanical stre...

Claims

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