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Radiation sensitive resin composition, cured resin and liquid crystal display device

A resin composition, radiation-sensitive technology, used in static indicators, instruments, photoengraving of patterned surfaces, etc.

Inactive Publication Date: 2011-05-18
SUMITOMO CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, when the above-mentioned polymer is used to prepare a radiation-sensitive resin composition, there will be a problem of narrow developing range.

Method used

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  • Radiation sensitive resin composition, cured resin and liquid crystal display device
  • Radiation sensitive resin composition, cured resin and liquid crystal display device
  • Radiation sensitive resin composition, cured resin and liquid crystal display device

Examples

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Effect test

example

[0162] Some examples are given below to illustrate the present invention, but the scope of application of the present invention is not limited thereto.

Synthetic example 1

[0164] Into a 200ml four-necked flask equipped with stirring, a condenser and a thermometer, put the following substances, and replace the oxygen in the flask with nitrogen. The flask was placed in an oil bath to keep the internal temperature of the flask at 75° C. to 85° C., and then stirred continuously for 5 hours under the protection of nitrogen flow to generate resin solution Al. The weight average molecular weight of A1 measured in terms of polystyrene was 11000 (molecular weight distribution: 2.0).

[0165] 2-(methacryloyloxy)ethyl acetoacetate 20.85g

[0166] 3-Ethyl-3-methacryloyloxymethyloxetane 17.94g

[0167] Ethyl lactate 90.51g

[0168] Azobisisobutyronitrile 0.7g

[0169] Measure the average molecular weight of the product with the polystyrene scale standard by the GPC method, and the experimental conditions are:

[0170] Instrument: MLC-8120GPC (manufactured by Tosoh Corporation)

[0171] Column: TSK GEL G4000HXL+TEK-GEL G2000HXL (serial connection)

[01...

Synthetic example 2

[0181] Resin solution A2 was prepared by the method in Synthesis Example 1, but the composition was changed, as shown below, the internal temperature of the flask was 80-90°C. The weight average molecular weight of A2 measured by polystyrene calibration was 12000 (molecular weight distribution: 2.1).

[0182] Methacrylic acid 7.10g

[0183] Cyclohexyl methacrylate 15.86g

[0184] 3-Ethyl-3-methacryloyloxymethyloxetane 21.71g

[0185] Ethyl lactate 104.25g

[0186] Azobisisobutyronitrile 1.06

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Abstract

The present invention provides a radiation sensitive resin combination which contains a copolymer (A) and a quinone diazide (B), wherein, the copolymer (A) contains a structure unit (a1) which is derived from an unsaturated compound which contains one kind of a combination consisting of at least active methylene and active methine. The copolymer (A) contains the other structure unit (a2) which is derived from the unsaturated compound which contains a group which is sensitive to light and / or heat, wherein, the unsaturated compound which generates the structure unit (a1) and is selected from one kind of the combination consisting of at least the active mythylene and the active methane is a structure formula (I) or a formula (II).

Description

technical field [0001] The invention relates to a radiation sensitive resin composition, a cured resin pattern and a liquid crystal display. Background technique [0002] Radiation-sensitive resin compositions can be used as raw materials for the production of resins with curing properties, such as heat-insulating films for thin-film transistors (hereinafter abbreviated as TFT) type liquid crystal displays, scattering plates for reflective TFT substrates, organic EF heat-insulating films and A protective film for a solid-state image sensor (hereinafter abbreviated as CCD) and the like (see JP-A No. H09-152625, paragraph numbers 0001 and 0010 for details). [0003] For the cured resin structure, its cross-sectional shape is tapered or gradually thickened or similar, and there will be different design choices according to the above-mentioned different purposes. Therefore, when using a radiation-sensitive resin composition to prepare a certain cured resin, the structure of th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/004G02F1/133
CPCG03F7/0007G03F7/022G03F7/0397
Inventor 武部和男
Owner SUMITOMO CHEM CO LTD