Radiator and its production thereof

Abstract

A heat dissipation device for a heat-generating package is composed of a cavity, a working fluid, an evaporating unit, a condensing unit, and fine grooves. Its preparing process includes such steps as preparing die, and using the die to prepare said evaporating unit, condensing unit and fine grooves on the inner surface of said cavity.

Description

technical field [0001] The invention relates to a heat dissipation device and a manufacturing method thereof, in particular to a heat uniform temperature chamber and a manufacturing method thereof. Background technique [0002] With the advancement of technology, the number of transistors per unit area of ​​electronic components is increasing, resulting in an increase in heat generation during operation. Therefore, in order to maintain the electronic components at an effective operating temperature, most of the current methods use external fans and cooling fins to deal with the heat dissipation. And because the heat pipe (heatpipe) can transmit a large amount of heat for a considerable distance under a small cross-sectional area and temperature difference, and can work without an external power supply, it does not require power supply and space utilization economy In consideration, heat pipes are already one of the widely used heat transfer components in electronic cooling ...

AI Technical Summary

Problems solved by technology

However, due to the phenomenon of metal annealing after high-temperature sintering, the metal cavity will soften. In order to avoid the softening of the metal cavity, it is easy to deform once it is subjected to external force. It is necessary to use a thicker metal cavity to support it.

However, a thicker metal cavity will reduce the heat dissipation rate of the thermal uniform cavity and increase the overall weight

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