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Pattern checking device

An inspection device and pattern technology, applied in measurement devices, optical devices, material analysis by optical means, etc., can solve the problems of difficult inspection, narrow space between wirings, etc., and achieve the effect of reducing reflected light components and excellent contrast.

Inactive Publication Date: 2006-04-26
USHIO DENKI KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0021] However, recently, patterns have become denser (thin wiring, narrow spaces between wiring), and it is difficult to check only by adjusting the image.

Method used

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Examples

Experimental program
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Embodiment Construction

[0069] figure 1 It is a block diagram showing a schematic configuration of the wiring pattern inspection device according to the first embodiment of the present invention. In addition, although the wiring pattern inspection of the TAB tape is described in the following examples, the present invention can also be applied to the case of inspecting the pattern formed on the polyimide resin film using reflected illumination light other than the TAB tape.

[0070] The pattern inspection device of this embodiment includes a tape conveying mechanism 10 ;

[0071] In the vicinity of the winding coiler 12, a marking unit 3 for marking a defective pattern is provided. In the marking part 3, the pattern judged to be unacceptable is punched with a puncher, or marking such as coloring is carried out so that the part can be immediately confirmed as unacceptable by visual inspection.

[0072] The TAB tape 5 fed out from the feeding winder 11 is sent to the inspection unit 1 . Conveyance ...

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Abstract

To increase the contrast between a wiring part and a resin film part to easily detect a wiring pattern by reflective illumination. A TAB tape 5 having the wiring pattern formed thereon is unwound from a feed-out reel 11 to be fed to an inspection part 1 and illuminated by a reflective illumination means 1a to image the inspection pattern on the TAB tape 5 by an imaging means 1b in the inspection part 1. The image of the imaged inspection pattern is sent to a control part 4 and compared with a reference pattern to determine the quality of the pattern. The light source of the reflective illumination means 1a is, for example, an infrared LED for emitting only light with a wavelength of 500 nm or more. Since only the light with the wavelength of 500 nm or more which penetrates the TAB tape 5, an image of good contrast can be obtained. Further, if the infrared reflectivity of a stage 1c is set to be less than 10% and the stage 1c is provided, an image with better contrast can be obtained.

Description

technical field [0001] The present invention relates to a pattern inspection device, and particularly relates to irradiating illumination light to a TAB (Tape Automated Bonding) tape using a tape loading method, and photographing patterns such as integrated circuits (ICs) formed on the TAB tape with an imaging unit A pattern inspection device that performs visual inspection automatically. Background technique [0002] Semiconductor devices respond to demands for high integration and high-density mounting, and lead wires are multiplied and miniaturized. In order to facilitate the multi-pin and miniaturization, a method of connecting a semiconductor chip to a plurality of leads provided on a thin-film TAB tape is employed. [0003] Figure 7 Indicates the sequence and structure of TAB tape production (cross-sectional view). [0004] TAB with such as Figure 7 As shown in (a), it is formed of a polyimide resin film with a thickness of about 20 to 150 μm (mostly 25 to 75 μm) a...

Claims

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Application Information

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IPC IPC(8): G01N21/956G01B11/24H01L21/66
CPCG01N21/95684G01N2021/3181G01N2021/5957G01N2201/102
Inventor 永森进一林宏树
Owner USHIO DENKI KK
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