Pattern checking device

An inspection device and pattern technology, applied in measurement devices, optical devices, material analysis by optical means, etc., can solve the problems of difficult inspection, narrow space between wirings, etc., and achieve the effect of reducing reflected light components and excellent contrast.
CN1763511AInactive Publication Date: 2006-04-26USHIO DENKI KK
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
USHIO DENKI KK
Publication Date
2006-04-26
Estimated Expiration
Not applicable · inactive patent

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Abstract

To increase the contrast between a wiring part and a resin film part to easily detect a wiring pattern by reflective illumination. A TAB tape 5 having the wiring pattern formed thereon is unwound from a feed-out reel 11 to be fed to an inspection part 1 and illuminated by a reflective illumination means 1a to image the inspection pattern on the TAB tape 5 by an imaging means 1b in the inspection part 1. The image of the imaged inspection pattern is sent to a control part 4 and compared with a reference pattern to determine the quality of the pattern. The light source of the reflective illumination means 1a is, for example, an infrared LED for emitting only light with a wavelength of 500 nm or more. Since only the light with the wavelength of 500 nm or more which penetrates the TAB tape 5, an image of good contrast can be obtained. Further, if the infrared reflectivity of a stage 1c is set to be less than 10% and the stage 1c is provided, an image with better contrast can be obtained.
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Description

technical field

[0001] The present invention relates to a pattern inspection device, and particularly relates to irradiating illumination light to a TAB (Tape Automated Bonding) tape using a tape loading method, and photographing patterns such as integrated circuits (ICs) formed on the TAB tape with an imaging unit A pattern inspection device that performs visual inspection automatically. Background technique

[0002] Semiconductor devices respond to demands for high integration and high-density mounting, and lead wires are multiplied and miniaturized. In order to facilitate the multi-pin and miniaturization, a method of connecting a semiconductor chip to a plurality of leads provided on a thin-film TAB tape is employed.

[0003] Figure 7 Indicates the sequence and structure of TAB tape production (cross-sectional view).

[0004] TAB with such as Figure 7 As shown in (a), it is formed of a polyimide resin film with a thickness of about 20 to 150 μm (mostly 25 to 75 μm) a...

Claims

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