General in-situ programmeable gate array configuration wiring model

A layout and routing, gate array technology, applied in the field of VLSI, can solve problems such as complex structure of FPGA
CN1776693AInactive Publication Date: 2006-05-24FUDAN UNIV

Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
FUDAN UNIV
Publication Date
2006-05-24
Estimated Expiration
Not applicable · inactive patent

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
  • Figure 3
    Figure 3
Patent Text Reader

Abstract

The invention belongs to technical area of very large-scale integrated circuit, specific to layout and wiring model of general field programmable gate array. Based on VPR scientific model, the disclosed model improves connection box (CB) model and switching box model (SB) in VPR. Thus, the possessing representative ness, comparative flexibility, the new model can process structure of CB and SB in FPGA. Based on the model, combining relevant method of software process, the invention starts from an initial FPGA structure, changes structure of CB and SB, and finds optimal structure of CB and SB relevant to this FPGA structure. Test result shows that the disclosed model possesses important guiding effect for optimizing FPGA structure.
Need to check novelty before this filing date? Find Prior Art

Description

technical field

[0001] The invention belongs to the technical field of ultra-large-scale integrated circuits, and in particular relates to a layout and wiring model irrelevant to the specific structure of FPGA. Background technique

[0002] Since Xilinx launched FPGA (Field Programmable Gate Array) in 1985, FPGA has been widely used. Initially, FPGAs were used for small-batch production such as prototypes, and could only implement simple digital circuits; as FPGAs improve in terms of speed, power consumption, and integration, today's FPGAs can implement complex digital systems including memory and processors. , the integration level of the chip reaches 10 million gates, and the speed reaches 300MHz. In addition to the manufacturing process, most of this huge change is the result of structural improvements. Academia and industry have conducted extensive research on logic blocks and wiring structures. However, most of these research works are based on academic research, and ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More