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Epoxy resin composite taking spherical silicon powder as filler, preparation method and application thereof

A technology of epoxy resin and spherical silicon, which is applied in the direction of electrical components, circuits, and electrical solid devices, can solve the problems of low product yield and high price, and achieve the effects of less flash, excellent flow performance, and excellent fluidity

Inactive Publication Date: 2010-04-21
北京中新泰合电子材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, the product yield is low and the price is relatively expensive

Method used

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  • Epoxy resin composite taking spherical silicon powder as filler, preparation method and application thereof
  • Epoxy resin composite taking spherical silicon powder as filler, preparation method and application thereof
  • Epoxy resin composite taking spherical silicon powder as filler, preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment A

[0043] Select 100 parts of biphenyl epoxy resin (DTP-101, epoxy equivalent 191, melting point 105°C), 90 parts of aralkyl phenolic resin (XLC-3L, hydroxyl equivalent 172, softening point 71.5°C), 1,8- 3 parts of diazacyclo[5,4,0]undecene-7(DBU), Mg(OH) 2 20 parts of flame retardant, 1473 parts of spherical silicon powder I, 5 parts of silane coupling agent (KH560), 3 parts of carnauba wax, 2 parts of carbon black, the above raw materials are mixed evenly in a two-roller rubber mixer, and the mixing temperature 85 ~ 90 ℃, cooling and pulverizing after kneading to make sample powder.

Embodiment B

[0045] Except for 1473 parts of spherical silicon powder II, the selected components are the same as in Example A, and the preparation method is also the same as in Example A.

Embodiment C

[0047] Except for 1473 parts of spherical silicon powder III, the selected components are the same as in Example A, and the preparation method is also the same as in Example A.

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PUM

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Abstract

The invention provides an epoxy resin composite taking home-made spherical silicon powder as a filler. The epoxy resin composite consists of an epoxy resin, a phenolic resin, spherical silicon dioxide powder, a flame retardant, an accelerant, a coupling agent, a release agent and a colorant, wherein the spherical silicon dioxide powder is prepared by a melted jet method by taking natural silicon dioxide powder as a raw material; and the silicon powder with median particle diameter of 5-20 microns is prepared from the spherical silicon powder with different grain diameters. The epoxy resin composite comprises 84-90 percent of filler. The invention has the advantages of excellent fluidity, few overflow materials, good moulding processing property and capability of packaging large-scale or super-large scale integrated circuit.

Description

technical field [0001] The present invention relates to an epoxy resin composition, more specifically, relates to an epoxy resin composition with spherical silicon powder as filler. [0002] The present invention also relates to a preparation method of the above-mentioned epoxy resin composition. [0003] The present invention also relates to the application of the above-mentioned epoxy resin composition. Background technique [0004] In the epoxy resin composition, the amount of the filler accounts for 84-90% of the total composition, so the performance of the filler plays an important role in the performance of the composition, especially the particle size and particle size distribution of the spherical silica powder . The spherical silicon powder used in the known technology is prepared by using natural quartz powder as a raw material through a melt-spraying method, and the median particle size is 5-40 μm. However, if only this kind of spherical silicon powder is used ...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L61/06C08K13/04C08K7/18H01L23/29
Inventor 赵秀芹王金红王成杨东辉孙忠贤
Owner 北京中新泰合电子材料科技有限公司
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