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Liquid-cooled column-type heat tube radiator

A heat pipe radiator, cylindrical technology, applied in cooling/ventilation/heating transformation, instruments, electrical digital data processing, etc. Large and other problems, to achieve the effect of compact structure, light weight and small volume

Inactive Publication Date: 2006-05-24
嘉善华昇电子热传科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, at present, the air-cooled heat dissipation module of the heat pipe is relatively large in size, and the heat transfer area of ​​the liquid-cooled heat dissipation module is relatively small, so the heat transfer capability and application range are limited to a certain extent.

Method used

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  • Liquid-cooled column-type heat tube radiator
  • Liquid-cooled column-type heat tube radiator
  • Liquid-cooled column-type heat tube radiator

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] Embodiment 1: refer to figure 1 , figure 2 , this liquid-cooled cylindrical heat pipe radiator includes a cylindrical heat pipe 1, a deflector 2, an outer sleeve 3, a sleeve cover 4, a connecting pipe 5, and a buckle 6. A deflector 2 is socketed or welded on the outer wall of the tube body 1-2 of the cylindrical heat pipe 1. The deflector 2 is used to increase the flow rate and disturbance of the liquid and enhance heat transfer. At the same time, the deflector 2 and the cylindrical heat pipe The tube body 1-2 of 1 is in close contact to form a heat dissipation surface; an outer sleeve 3 is provided outside the deflector 2, and the inner wall surface of the outer sleeve 3, the outer wall surface of the cylindrical heat pipe 1 and the deflector 2 form a connected liquid channel 7; The upper end of the outer casing 2 is provided with a sleeve cover 4, and the outer casing 3 is provided with a liquid connecting pipe 5 respectively connected to both ends of the liquid pas...

Embodiment 2

[0035] Embodiment 2: refer to image 3 , the difference from Embodiment 1 is that the liquid connecting pipe 5 is arranged on the sleeve cover 4 of the liquid-cooled cylindrical heat pipe radiator, and the buckle can be easily installed or replaced according to the use occasion and the fastening method. 6.

Embodiment 3

[0036]Embodiment 3: refer to Image 6 , the difference from Embodiments 1 and 2 is that one or more spiral deflectors 2 are welded or socketed on the outer wall of the cylindrical heat pipe 1 or directly on the outer wall of the cylindrical heat pipe 1 body 1-2, Cooperate with the inner wall surface of the outer sleeve 3 and the outer wall surface of the cylindrical heat pipe 1 to form a spiral liquid channel 7 , the liquid connecting pipe 5 can be arranged on the side of the outer sleeve 3 or on the sleeve cover 4 . The deflector 2 not only increases the heat dissipation area, but also increases the liquid flow rate and disturbance, strengthens the heat absorption of the cooling liquid, reduces the thermal resistance, and has a better heat dissipation effect.

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Abstract

A liquid-cooling type column shape heat-pipe radiator comprises column-shape heat pipe, diversion sheet on the external wall of the heat pipe, external casing pipe fitted on the outer side of the diversion sheet. The inner wall of the external casing pipe, the outer wall of the heat pipe and the diversion sheet form a liquid passage. On the external casing pipe or the casing pipe cover is fitted with a liquid connection tube communicated respectively to the two ends of the liquid passage. The lower end face of the casing pipe is provided together with the base plate of the column-shape heat pipe. Advantages: largely reduced thermal resistance and raised heat-conducting ability, small volume, light weight and compact structure.

Description

technical field [0001] The invention relates to a cooling device, in particular to a liquid-cooled cylindrical heat pipe radiator used in high-power electronic components such as computer CPUs, communications, photoelectric lighting, and IGBTs. Background technique [0002] With the development and miniaturization of electronic products such as computers, communications, and photoelectric lighting LEDs at an astonishing rate in the "Moore's Law" equivalent series, the relative heat treatment problems are also increasing, and the heat flux is also increasing. How to solve this heat dissipation problem in a limited space and ensure the normal operation of electronic products requires that cooling module manufacturers and related scientific research institutions around the world increase investment in scientific research, actively seek and develop new types of high-efficiency heat dissipation that can meet the development needs of next-generation electronic products components....

Claims

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Application Information

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IPC IPC(8): H05K7/20G06F1/20
Inventor 仝爱星廖仁琦王占篱
Owner 嘉善华昇电子热传科技有限公司
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