Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Wafer support member and semiconductor manufacturing system using the same

A technology for supporting members and wafers, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as complex structures, and achieve effective error improvement.

Inactive Publication Date: 2006-05-31
KYOCERA CORP
View PDF2 Cites 11 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] In addition, for example, it is necessary to separately provide a through-hole for vacuuming and a connection structure, and there is a further problem that the structure is complicated.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Wafer support member and semiconductor manufacturing system using the same
  • Wafer support member and semiconductor manufacturing system using the same
  • Wafer support member and semiconductor manufacturing system using the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0047] figure 1 It is a perspective view showing the structure of the wafer support member in Embodiment 1 of this invention. figure 2 yes figure 1 The cross-sectional view of the X-X line.

[0048] Wafer support member 1 according to Embodiment 1 of the present invention includes plate-shaped ceramic body 2 having approximately the same size as wafer W, and one main surface thereof serves as placement surface 8 on which the wafer is placed. Also, a pair of electrostatic adsorption electrodes 4 are buried inside the plate-shaped ceramic body 2, and the power supply terminal 5 for energizing the electrostatic adsorption electrodes 4 is embedded on the other main surface of the plate-shaped ceramic body 2, and the One end of the power supply terminal 5 is exposed. In addition, on the other main surface side of the plate-shaped ceramic body 2 , on the back surface of the wafer W, the conductive pipe 6 for ventilation is bonded to the plate-shaped ceramic body 2 through the ...

Embodiment approach 2

[0057] image 3 , is a perspective view showing an example of a wafer supporting member according to Embodiment 2 of the present invention. In the electrostatic chuck shown in Embodiment 1, one electrode of the resistance meter 21 is connected to the current-carrying terminal 12 through the wire 23. In contrast, in the electrostatic chuck of Embodiment 2, one electrode of the resistance meter 21 is The electrostatic chuck according to Embodiment 2 is different from the electrostatic chuck according to Embodiment 1 in that it is connected to a conductive tube 36 via a wire 23 . Other configurations are the same as those of the electrostatic chuck according to the first embodiment. Due to the above differences, the electrostatic chuck according to the second embodiment is superior to the electrostatic chuck according to the first embodiment in that oxidation of the soldered portion 32 a can be prevented. Hereinafter, the electrostatic chuck according to Embodiment 2 will be de...

Embodiment approach 3

[0066] Figure 4 It is a perspective view showing an example of the wafer support member 1 according to Embodiment 3 of the present invention. The electrostatic chuck shown in Embodiment 2 above, such as image 3 As shown, the conductive pipe 36 to which one electrode of the resistance meter 21 is connected by the wire 23 is connected to the connection conductive layer 10 by the conductive member 32 and the embedded conductive layer 11. In this respect, in the electrostatic chuck according to the third embodiment, Such as Figure 4 As shown, the electrostatic chuck in the third embodiment is different from the electrostatic chuck in the second embodiment in that the conductive tube 46 is connected to the conductive layer 60 directly. Other configurations are the same as those of the electrostatic chuck in the second embodiment. Because of the above-mentioned differences, the electrostatic chuck of Embodiment 3 does not need to make the conductive member 32 and the embedded ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention provides a simple and practical wafer support member that enables highly reliable electrical connection between a conductive layer formed on a placement surface and a power supply terminal on the atmosphere side while maintaining vacuum sealing. This wafer support member includes: a plate-shaped ceramic body having one main surface as a placement surface on which a wafer is placed, and a through hole penetrating from the one main surface to the other main surface; and a ceramic body provided on the placement surface. a conductive layer; a connecting conductive layer connected to the conductive layer and provided on the inner surface of the through hole; and a buried conductive layer connected to the connecting conductive layer and embedded in the plate-shaped ceramic body; and having one end and another One end is connected to the buried conductive layer in the vicinity of the one end, and the other end protrudes from the other main surface of the ceramic body, and is provided at a position away from the through hole of the plate-shaped ceramic body.

Description

Technical field: [0001] The present invention relates to a wafer support member for holding a workpiece such as a semiconductor wafer in a coating device and an etching device (semiconductor wafer processing system) such as a PVD device, a CVD device, an ion plating device, and a vapor deposition device. In particular, a semiconductor manufacturing device using this relates to a feed-through structure in which an electrode provided on the vacuum side is connected to a terminal provided on the atmosphere side. Background technique: [0002] A semiconductor wafer processing system generally includes a wafer support member inside, that is, a processing container equipped with a suscepter. The wafer support member is used to support the wafer in the processing container. The wafer support member is composed of various components for fixing the wafer to hold the wafer at a predetermined position on the wafer placement surface of the wafer support member, and various components fo...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683H01L21/00H01L21/67
CPCH01L21/67103H01L21/6831H01L21/68785H01L21/68
Inventor 井之上博范
Owner KYOCERA CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com