Encapsulation structure for multiple chips

Abstract

The encapsulation structure includes lead frame, first and second chips and leads. The lead frame possesses following parts: first chip seat including opposite first face for sticking chip and first face for not sticking chip; second chip seat including opposite second face for sticking chip and second face for not sticking chip; structure for connecting first and second chip seats, and for connecting chip seats faced to first face for sticking chip and second face for not sticking chip; inner pins with connection faces for leads. First chip possesses first not active surface opposite to first active surface with first pads. The first not active surface is stuck to part of first face for sticking chip. Second chip possesses second not active surface opposite to second active surface with second pads. Part of second active surface is stuck to the second face for sticking chip. The said second face avoids covering second pad. Conducting wire connects first and second pads.

Description

technical field [0001] The present invention relates to a multi-chip packaging structure, and in particular to a multi-chip packaging structure in which two chips with the same or similar dimensions are supported by several chip holders with height differences. Background technique [0002] As far as the current semiconductor packaging technology is concerned, a package of colloid is usually used to cover multiple chips to achieve more than double the capacity or more functional requirements, which is the so-called multi-chip packaging structure. For example, a two-chip package structure can be obtained by combining and packaging two chips with the same or similar size. Wherein, the above-mentioned two chips with the same or similar size may have the same function or different functions. [0003] Please refer to figure 1 , which shows a cross-sectional view of a conventional multi-chip packaging structure. exist figure 1 Among them, the multi-chip package structure 10 in...

AI Technical Summary

Problems solved by technology

As a result, it is bound to increase the overall thickness of the packaging structure, packaging process and material costs

At the same time, since the packaging structure has materials with different coefficients of thermal expansion (CTE), such as chip holders, dummy chips or spacers, chips, inner leads, and encapsulants, the packaging structure will have serious thermal expansion coefficients. Matching problems, which in turn affect the reliability of the package structure

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