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Technological process for selective plating copper on through holes of flexible multiple layered printing circuit board

A technology of multi-layer printing and process method, which is applied in the direction of electrical connection formation of printed components, etc., can solve the problems of inflexibility and poor bending of flexible multi-layer printed circuit boards, so as to increase the number of bending times and increase flexibility. degree, the effect of increasing the folding resistance

Active Publication Date: 2006-07-05
CHUNHUA TECHNOLOGICAL KUSN
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  • Claims
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Problems solved by technology

The steps are: after through-hole electroplating, use the method of current conduction to thicken the chemical copper on the wall of the through-hole. At this time, in addition to thickening the copper on the wall of the through-hole, the original copper is also electroplated. A layer of copper, and the formation of this layer of copper is electrolysis, the arrangement of copper crystals is granular and longitudinally expanded, while the original copper is processed by rolling, and the arrangement of copper crystals is horizontally expanded, so the traditional Flexible multilayer printed circuit boards made by copper plating are not resistant to folding and have poor bending properties

Method used

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  • Technological process for selective plating copper on through holes of flexible multiple layered printing circuit board
  • Technological process for selective plating copper on through holes of flexible multiple layered printing circuit board
  • Technological process for selective plating copper on through holes of flexible multiple layered printing circuit board

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Embodiment

[0019] Example: see Figure 1 to Figure 5 , a process method for selective copper plating of via holes in flexible multilayer printed circuit boards, which is completed in the following steps: ①. Through-hole electroplating: through-hole electroplating is performed on flexible multilayer printed circuit boards with via holes drilled ; ②. Lamination: A layer of dry film is laminated on the flexible multilayer printed circuit board after through-hole plating; ③. Exposure: Use the principle of film exposure to expose the dry film at the position of the via hole, and the dry film at other positions Reserve; ④. Imaging: develop the via hole ring on the copper foil, that is, remove the dry film on the via hole; ⑤. Copper plating: At this time, except for the position of the via hole ring, other Some parts are covered with dry film, so that when electroplating, only the via holes are electroplated; ⑥. Stripping: peel off the dry film with the principle of chemical liquid reaction.

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Abstract

The method includes: 1) plates through-hole on the flexible multilayer circuit board on which the through-hole is drilled; 2) presses a dry film on the flexible multiplayer circuit board whose through-holes are plated; 3) light exposing method is used to indicate the location of the through-hole; 4) develops the image of through-hole on the copper foil to distinguish the location of through-hole from the other area covered by the dry film; 5) plates the through hole with copper; 6) remove the dry film by using chemical agent. The flexible multilayer circuit board can bear 60,000-100,000 times of bending.

Description

technical field [0001] The invention relates to a process method for copper plating of a printed circuit board. Background technique [0002] The connection method of multilayer boards in the current flexible multilayer printed circuit board is to drill via holes, and then plate copper on the via holes. The traditional copper plating method is to plate copper on the whole board, that is, to plate copper on the via holes and at the same time to plate copper on the entire board. The steps are: after through-hole electroplating, use the method of current conduction to thicken the chemical copper on the wall of the through-hole. At this time, in addition to thickening the copper on the wall of the through-hole, the original copper is also electroplated. A layer of copper, and the formation of this layer of copper is electrolysis, the arrangement of copper crystals is granular and longitudinally expanded, while the original copper is processed by rolling, and the arrangement of ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/42C25D5/02
Inventor 李古冬刘咏东莫卫龚张宁
Owner CHUNHUA TECHNOLOGICAL KUSN
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