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Quality management system of print substrate

A printed substrate, quality management technology, applied in measuring devices, material analysis through optical means, instruments, etc., can solve problems such as bad confirmation

Active Publication Date: 2006-08-09
ORMON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0016] However, until now, the confirmation of where the cause of the defect is and whether the defect can be dealt with at the manufacturing site has largely relied on the intuition and experience of skilled personnel at the manufacturing site, but there is no support for ensuring quality. Confirmed props (system as a tool)
Also, what is required at the manufacturing site is not to suddenly display problem countermeasures, but it is important to first confirm the status of the problem from the actual object, but there is no structure for realizing such an idea

Method used

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  • Quality management system of print substrate

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Experimental program
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no. 1 approach

[0111] First, an outline of processing in the quality control system according to the first embodiment of the present invention will be described with reference to FIG. 1 . In the present embodiment, the quality control at the time of production commissioning / mass production trial production is targeted.

[0112] In the production commissioning / mass production trial production before the full-scale production, generally speaking, it is necessary to repeat the trial production and the adjustment of the manufacturing conditions (hereinafter referred to as "SMT conditions" as the meaning of the manufacturing conditions related to surface mounting), Quality improvement in the field. The quality control system of this embodiment assists on-site problem solving by estimating the cause of the failure and determining its countermeasures when there is a problem with solder mounting quality.

[0113] As shown in FIG. 1 , in this system, images are taken of each printed board after rece...

no. 2 approach

[0228] FIG. 30 shows an outline of processing in the quality control system according to the second embodiment of the present invention. Compared with the first embodiment, the quality control system of this embodiment is the same in that it performs the estimation of the cause of the failure and the determination of the SMT conditions that need to be adjusted, and the difference lies in the subsequent processing (adjustment condition analysis) that assists the improvement of the condition value. deal with).

[0229] Specifically, after determining the SMT conditions requiring adjustment in the same manner as in the first embodiment, the quality control system determines a plurality of condition values ​​with slightly different values ​​for the SMT conditions. These conditional values ​​are used for tuning tests. The user adjusts the condition value for the test according to these, slightly changes the SMT condition, and repeats the trial production. The quality control syst...

no. 3 approach

[0255] Currently, Japan's manufacturing industry is groping for ways to survive as a production location. The environment surrounding the domestic manufacturing industry is becoming more and more severe due to the shortening of the service life of products, the reduction of shipments, and the transfer of production sites to China. Then, in order to survive as a production place, Japan began to challenge the new production method (required simultaneous production) that needs to be produced simultaneously. Need-synchronized production refers to a production method that is synchronized with demand and quality, and is conducive to the production of small quantities and multiple varieties.

[0256] In this synchronous production, production and quality need to be controlled at the same time, and production and quality must be consistent in time. This is because, in the case of the existing mass production method, how many defects are planned out of the 10,000 manufactured, and the...

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PUM

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Abstract

To provide a quality control system of a printed board for realizing efficient quality control.An imaging means picks up images of a printed board in each process in a series of processes for soldering components on the printed board. An image storage means stores (accumulates) the picked-up images in each of processes so that they may be correlated. An inspection means inspects the solder mounting quality from the picked-up image of the final process. Then, if a failure is detected by inspection, a candidate event selecting means selects one or more events which may be a cause of the failure among the events which may be generated in designing steps or an intermediate processes in manufacturing. An event analyzing means determines the degree of occurrence of each of candidate events by referring to the picked-up images in the intermediate processes. A cause analyzing means estimates the cause of the failure on the basis of combinations of the degree of occurrence of each of the candidate events.

Description

technical field [0001] The present invention relates to a quality management system used for quality inspection and management during production debugging (mass production and trial production) of printed substrates and formal production. Background technique [0002] The mounting density of printed circuit boards, with the emergence of surface mount technology (SMT; Surface Mount Technology, also known as surface mount technology) that directly solders electronic components such as chip components on the surface of printed circuit boards, and the miniaturization of electronic components And made a leap forward. The improvement of the mounting density of a printed circuit board greatly contributes to the miniaturization of an electronic device product. In the surface mount technology method, creamy solder (solder paste) is screen-printed on the electrode portion (pad) of the printed circuit board, and electronic components are mounted on the surface by a component mounting ...

Claims

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Application Information

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IPC IPC(8): H05K13/08G01N21/956
Inventor 清水敦森弘之岸本真由子平冈义明中田刚司
Owner ORMON CORP
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