Check patentability & draft patents in minutes with Patsnap Eureka AI!

Method for recovering communication of I2C main device and I2C slave device

A master device and device technology, which is applied in the field of restoring I2C master device and I2C slave device communication, to achieve the effect of reducing cost, improving anti-interference and increasing reliability

Inactive Publication Date: 2006-09-13
HUAWEI TECH CO LTD
View PDF0 Cites 17 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] The object of the present invention is to provide a kind of recovery I 2 C master and I 2 C from the method of device communication, to solve the prior art because I 2 I 2 C master reset cannot continue to I 2 Problems with read operations from C slave devices

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for recovering communication of I2C main device and I2C slave device
  • Method for recovering communication of I2C main device and I2C slave device
  • Method for recovering communication of I2C main device and I2C slave device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0029] I 2 C master and I 2 C slave devices utilize the I 2 In the process of C bus communication, if I 2 C master device is on the I 2 When the C slave device is performing a read operation, the communication is interrupted abnormally, and the I 2 The data sent by the C slave device when the communication is interrupted is "0", so in the I 2 After the power-on reset of the C main device, the SDA line has been kept low, and the I 2 The C slave device has been in the state of waiting to read, so the I 2 The C master cannot communicate with the I 2 C slave for normal communication.

[0030] If I 2 The data sent by the C slave device when the communication is interrupted is "1", then the SDA line is high, so that the I2 After a power-on reset of the C master device, the I 2 C slave can release the bus, I 2 The C master can access the I 2 C slave device, can be on the I 2 C slave initiates new communication. However, due to the I 2 It is difficult to control the timi...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A method for restoring communication of I2 C main component and I2 C slave component includes forcing to input SCL clock signal to I2 C slave component by I2C main component to let I2 C slave component release SDA data line so as to make I2 C bus restore to be normal readable and write - able state.

Description

technical field [0001] The present invention relates to I 2 C master and I 2 C slave devices, especially a recovery I 2 C master and I 2 C slave device communication method. Background technique [0002] I 2 C (Inter-Integrated Circuit, interactive integrated circuit) bus is a two-wire bus used for connection between integrated chips, which is composed of SDA (serial data line) and SCL (serial clock line) Serial bus, which transmits information between devices connected to the bus through SDA and SCL, with a maximum transfer rate of 3.4Mbps. Currently, I 2 C bus has become an international standard and is widely used in communication, industrial control and other fields. [0003] when a certain I 2 When the C-bus interface device sends information to the bus, it is the I 2 C master, and when it receives information from the bus, it becomes the I 2 C slave, I 2 C master and I 2 C from the device can work in receiving and sending state. in I 2 During the working ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G06F13/38G06F13/42
Inventor 叶荣标邱锦陈祺柳精伟
Owner HUAWEI TECH CO LTD
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More