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Defect inspection method

A defect inspection and defect technology, applied in the field of defect inspection, can solve the problems of increasing inspection sensitivity and decreasing inspection sensitivity, and achieve the effect of reducing time

Inactive Publication Date: 2006-10-04
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

That is, a trade-off relationship is observed between the threshold and inspection sensitivity such that inspection sensitivity decreases when the threshold increases and inspection sensitivity increases when the threshold decreases

Method used

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no. 1 example

[0056] Referring to the drawings, a defect inspection method according to a first embodiment of the present invention will be described with respect to the drawings.

[0057] figure 1 Shows the processing flow of the defect inspection method according to the first embodiment, specifically the method for determining a threshold for defect detection through noise evaluation according to the present invention. Figures 2A to 2F are used to illustrate figure 1 A view of the individual steps of the processing flow (in particular, the signal transformation method according to the noise evaluation algorithm) shown in . Specifically, Figure 2A corresponds to figure 1 Step S102 of Figure 2B corresponds to figure 1 Steps S103 and S104 of Figure 2C correspond to figure 1 Step S105 of Figure 2D corresponds to figure 1 Step S106 of Figure 2E corresponds to figure 1 Step S107 and Figure 2F correspond to figure 1 Step S109. In the present embodiment, in the processing steps of FIGS. 2...

no. 2 example

[0119] Referring to the drawings, a defect inspection method according to a second embodiment of the present invention will be described with respect to the drawings.

[0120] Figure 7 It represents the processing flow of the defect inspection method according to the second embodiment of the present invention, specifically a method for determining the inspection focal length through noise evaluation according to the present invention. Figure 8A to Figure 8E and Figure 9 is for illustration Figure 7 A view of the individual steps of the processing flow shown in (in particular, the signal transformation method according to the noise evaluation algorithm). specifically, Figure 8A corresponds to Figure 7 Step S202, Figure 8B corresponds to Figure 7 Steps S203 and S204 of Figure 8C correspond to Figure 7 Step S205 of FIG. 8D corresponds to Figure 7 Step S206 of FIG. 8E corresponds to Figure 7 Steps S207 and S208 of and Figure 9 corresponds to Figure 7 Step S...

no. 3 example

[0135] Referring to the drawings, a defect inspection method according to a third embodiment of the present invention will be described with respect to the drawings.

[0136] Figure 10 Represents the processing flow of the defect inspection method according to the third embodiment of the present invention, specifically a method for adjusting inspection characteristics based on noise evaluation according to the present invention, so that each of the plurality of inspection units (detection systems) provided in the inspection equipment A method with the same inspection sensitivity. Figure 11A to Figure 11E is for illustration Figure 10 A view of the individual steps of the processing flow shown in (in particular, the signal transformation method according to the noise evaluation algorithm). Specifically, Figure 11A corresponds to Figure 10 Step S302 of FIG. 11B corresponds to Figure 10 Steps S303 and S304, Figure 11C corresponds to Figure 10 Step S305, Figure 11D...

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Abstract

By irradiating a substrate to be inspected with an energy beam, the energy beam reflected from the substrate to be inspected is obtained as a digital image signal. When the intensity of the obtained digital image signal exceeds a threshold, the digital image signal is detected as a defect. The threshold is set based on the maximum intensity of a noise signal included in the digital image signal.

Description

technical field [0001] The present invention relates to a defect inspection method that obtains an image from an inspection target using energy beams such as electron beams, light beams, or X-ray beams, and inspects defects in the inspection target by using the image, the image representing, for example, charged particles, Physical properties of reflected or scattered beams, such as semiconductor wafers, circuit boards, liquid crystal panels, photolithographic masks, magnetic disk heads, optical disks or hard disks on which circuit patterns are formed. More particularly, the present invention relates to a defect inspection method using an algorithm that determines whether a defect occurs by setting a threshold value on an image signal or a differential image signal. Background technique [0002] In recent years, there is an increasing tendency to produce more miniaturized electronic devices to improve performance and reduce chip costs, or larger area image devices to meet cu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N23/04G01N23/225G01N21/956G03F1/84G03F1/86G06T1/00H01L21/027
CPCG06T7/0004G06K2209/19G06K9/00G06V2201/06
Inventor 钟江健司
Owner PANASONIC CORP