Wafer connector

Abstract

The invention provides a crystal connector which is connected with a crystal. It comprises an inner seat with a plurality of terminal grooves and a disposition area of the terminal, wherein the plurality of terminals are positioned in the terminal grooves; it also comprises an electric arm with a contact to connect the crystal and an external seat with a bottom side and round walls to cover the inner seat; it arranges a fixed press plate upper to the front end to press the front end of the crystal; the two sides of the press plate has an electric arm to press the rear side of the crystal.

Description

technical field [0001] The invention relates to an electrical connector, in particular to a chip connector. Background technique [0002] The bottom surface of a chip (such as a CPU) is formed with several contacts arranged at intervals, and the electrical connector connected to this type of chip uses a pressure to fix the chip on the base, so that the contacts of the chip are arranged in the terminal groove of the base. The terminals are elastically contacted to ensure electrical connection. [0003] see figure 1 , is a known chip connector, which includes: an outer seat 10, an inner seat 20, and several terminals 25, wherein: [0004] The outer seat 10 is a metal material, and it includes: a base 11, a hollow area 13 is formed in the center of its bottom surface 12; edge 15; and a rocker 16, which is provided with a first rod 17 and a second rod 18, the second rod 18 is pivotally connected to the other end of the base 11 and has a curved portion 19 thereon. [0005] Th...

AI Technical Summary

Problems solved by technology

[0009] 1. The structure is relatively complicated. Its design is that the upper cover 14 covers the wafer 90, and then the rocker 16 is used to press the upper cover 14. The components of the outer seat 10 include a base 11, an upper cover 14, and a rocker 16. Therefore, it is difficult to effectively reduce the cost because of such cumbersome manufacturing.

[0010] 2. The operation is troublesome. It needs to press the wafer 90 with one hand, and shake the rocker 16 with the other hand to fix the wafer 90, so the operation is inconvenient

[0011] 3. See figure 2 and image 3 , the chip 90 is placed horizontally into the placement area 23 of the inner seat 20. When the chip 90 is pressed down by force, the terminal 25 only simply bounces up and down and the chip 90 has no displacement, so the contact point 27 of the terminal is in contact with the chip. The contacts of the contacts 91 are almost at the same position, and the change is very small, so there is no friction between the two, and there is no effect of scraping off the oxide layer

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