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Electronic equipment with foaming structure and producing method thereof

A technology of electronic equipment and manufacturing method, which is applied to the construction parts of electrical equipment, the installation of supporting structures, electrical components, etc., which can solve the problems of complex design and arrangement, increased difficulty, increased cost, etc., and achieve diversified appearance and simple process , The effect of reducing production costs

Inactive Publication Date: 2007-01-03
ASUSTEK COMPUTER INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Accordingly, the additional process will increase additional costs, and the installation position and manufacturing feasibility of the additional ribs, as well as the fixing method, all require complicated design and arrangement, which increases the difficulty of manufacturing and shortens the time schedule of product development. extend

Method used

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  • Electronic equipment with foaming structure and producing method thereof
  • Electronic equipment with foaming structure and producing method thereof
  • Electronic equipment with foaming structure and producing method thereof

Examples

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Embodiment Construction

[0021] A preferred embodiment of the present invention discloses a method for forming a foamed structural reinforcement, which is suitable for manufacturing electronic equipment. The foam structure is used to cover or wrap the electronic components to protect the electronic components from damage caused by external impact. In addition, because the foam structure has the characteristics of light weight, electronic products can still maintain the characteristics of lightness, thinness, shortness and smallness. Furthermore, because the method of forming the foamed structural reinforcing material is simple, the electronic product applying the present invention can have the characteristics of low cost and various appearances. The embodiments of the present invention can be used in various fields without limiting the patent scope of the present invention.

[0022] refer to Figure 1-6 , which is a cross-sectional view of a manufacturing process of a method for forming a foamed stru...

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PUM

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Abstract

A method for preparing electronic device with foamed structure includes providing a shell and an electronic element set in said shell, filling a foaming liquid into said shell and utilizing chemical foaming mode to foam said foaming liquid to be foamed structure, using foamed structure in said shell to cover or clad said electronic element for intensifying mechanical strength of shell and for absorbing impact of outside force in order to protect electronic element effectively.

Description

technical field [0001] The present invention relates to an electronic device with a foam structure, and more particularly to an electronic device that does not need to add reinforcing ribs and can maintain sufficient mechanical strength. Background technique [0002] With the increasingly fierce competition of electronic products, the life cycle of various electronic products is getting shorter and shorter, and the diversification of electronic product casings is also more important. Traditionally, the casing of electronic products is made of plastic injection, metal die-casting or metal stamping, etc., to make electronic products not only have the necessary strength and reliability, but also have a variety of appearance. In recent years, with the rapid development of technology and information, the manufacturing technology of electronic products is also improving day by day. Under the consideration of people's pursuit of portability and practicability, electronic products ...

Claims

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Application Information

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IPC IPC(8): H05K7/00H05K7/14B29C67/20
Inventor 詹佳潢
Owner ASUSTEK COMPUTER INC
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