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Substrate for manufacturing semiconductor device, semiconductor device manufacturing method

A semiconductor and substrate technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., can solve problems such as the decline of camera recognition

Inactive Publication Date: 2007-01-10
SEIKO EPSON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this case, there will be a problem that the imaging visibility of the flip chip bonding property during alignment will be reduced by the amount of thickening of the adhesive film.

Method used

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  • Substrate for manufacturing semiconductor device, semiconductor device manufacturing method
  • Substrate for manufacturing semiconductor device, semiconductor device manufacturing method
  • Substrate for manufacturing semiconductor device, semiconductor device manufacturing method

Examples

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Embodiment Construction

[0023] Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, in each drawing used for description below, the scale of each component is changed suitably so that each component may be recognized.

[0024] figure 1 It is a schematic plan view showing one embodiment of the semiconductor device manufacturing substrate of the present invention, figure 2 yes figure 1 The A-A' cross-sectional schematic diagram. figure 1 as well as figure 2 The illustrated substrate 50 for manufacturing a semiconductor device is constituted by using a wafer 1 including a plurality of semiconductor elements 5 as a base material. Here, the wafer 1 is formed using silicon.

[0025] Bumps 3 are formed on the surface of the wafer 1 . Specifically, the bump 3 is arranged on the peripheral portion of each semiconductor element 5, and each semiconductor element 5 is formed in a peripheral shape. An adhesive material layer 2 is formed on the w...

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PUM

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Abstract

A substrate for manufacturing semiconductor device includes a wafer; a plurality of semiconductor elements formed on the wafer; a bump arranged in each peripheral section of the semiconductor elements; an alignment mark arranged in the each peripheral section of the semiconductor elements; and an adhesive layer formed on the semiconductor elements. The adhesive layer has a greater thickness in each central section of the semiconductor elements where the bump is not provided than in the each peripheral section of the semiconductor elements.

Description

technical field [0001] The present invention relates to a substrate for manufacturing a semiconductor device and a method for manufacturing a semiconductor device using the substrate for manufacturing a semiconductor device. Background technique [0002] Conventionally, the general method of flip-chip mounting using an adhesive film such as an anisotropic conductive film or a non-conductive film is to supply the adhesive film to the substrate side, and heat and pressurize the IC on which the bump is attached. A method of connecting by bonding. [0003] However, in view of the recent high-density mounting requirements, it is proposed to reduce the protrusion of the adhesive film as much as possible, to mount other components near the IC, or to reduce the mounting area, and to pre-supply the adhesive film to the wafer side. It is cut and mounted with an adhesive film of the same size as the IC (for example, JP-A-2001-237268). [0004] According to such a method, when the sub...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/48H01L23/31H01L21/60H01L21/56
CPCH01L2224/73203H01L23/544H01L2924/01004H01L2224/81801H01L2224/16H01L2223/5448H01L2224/83193H01L2223/54473H01L21/563H01L2224/83102H01L2224/32225H01L24/27H01L2224/274H01L2224/83191H01L2224/92125H01L24/81H01L2924/01047H01L2224/73204H01L2924/01079H01L2924/01005H01L24/29H01L2924/01033H01L2924/01006H01L2924/01078H01L2224/16225H01L21/561H01L2224/26175H01L2224/29017H01L2224/29082H01L2224/73104H01L2224/81136H01L2924/00H01L21/48
Inventor 今井英生
Owner SEIKO EPSON CORP