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Cooling unit having heat radiating portion, through which liquid coolant flows and electronic apparatus equipped with cooling unit

A cooling unit and heat dissipation part technology, applied in the field of electronic equipment equipped with the cooling unit, can solve the problem that the heat of the CPU cannot be dissipated, the contact area between the conduit and the heat dissipation fin cannot be large enough, and the surface temperature of the heat dissipation fin cannot be effectively problems such as ground rise, to achieve the effect of rising surface temperature and improving heat dissipation performance

Inactive Publication Date: 2007-01-17
KK TOSHIBA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the contact area of ​​the tubes in contact with the fins cannot be large enough, and the heat of the liquid coolant cannot be easily transferred from the tubes to all parts of the fins
As a result, the surface temperature of the cooling fins cannot be effectively raised, so that the heat of the CPU cannot be effectively dissipated through the cooling part.

Method used

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  • Cooling unit having heat radiating portion, through which liquid coolant flows and electronic apparatus equipped with cooling unit
  • Cooling unit having heat radiating portion, through which liquid coolant flows and electronic apparatus equipped with cooling unit
  • Cooling unit having heat radiating portion, through which liquid coolant flows and electronic apparatus equipped with cooling unit

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Embodiment Construction

[0024] Attach the reference Figures 1 to 10 A first embodiment of the present invention will be described.

[0025] figure 1 A notebook computer 1 is disclosed as an electronic device. Notebook computer 1 includes a host unit 2 and a display unit 3 . The main unit 2 has a flat box-shaped first housing 4 . The first housing 4 has a bottom wall 4a, an upper wall 4b, a front wall 4c, left and right walls 4d, and a rear wall 4e. The front wall 4 c , the left and right walls 4 d , and the rear wall 4 e constitute the outer wall of the first housing 4 . The upper wall 4 b of the first housing 4 supports the keyboard 5 . A plurality of exhaust ports 6 are formed in the rear wall 4 e of the first housing 4 . The exhaust ports 6 are arranged in a line along the width direction of the first housing 4 .

[0026] The display unit 3 has a second housing 8 and a liquid crystal display 9 . The liquid crystal display 9 is located in the second casing 8 . The liquid crystal display 9...

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Abstract

A cooling unit includes a heat receiving portion thermally connected to a heat generating component, a heat radiating portion which radiates heat generated by the heat generating component, and a circulation path which circulates a liquid coolant between the heat receiving portion and the heat radiating portion. The heat radiating portion includes a first path portion, a second path portion, a third path portion, and a plurality of heat radiating fins. Each of the first and second path portions has a flat pipe through which the liquid coolant flows. The two pipes have cross sections which are elongated in the same direction and facing each other. The heat radiating fins are interposed between the two pipes and thermally connected to the two pipes.

Description

technical field [0001] The present invention relates to a liquid cooling type cooling unit that cools a heat-generating component such as a CPU by a liquid coolant, and also relates to an electronic device equipped with the cooling unit. Background technique [0002] CPUs are included in electronic equipment such as notebook computers. As the processing speed increases or its capabilities expand, the CPU generates more heat during operation. If the temperature of the CPU rises too high, the CPU will not be able to perform adequately, or may crash. [0003] Recently, in order to cool the CPU, a cooling system called a liquid cooling type has been put into practical use. In this type of cooling system, the CPU is cooled by a coolant that has a much higher specific heat than air. [0004] A conventional cooling system has a heat sink that absorbs heat from the CPU; a heat sink that dissipates the heat absorbed from the CPU; Communication between the heat part and the heat d...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/473F25D17/02F04D29/58F28D1/053F28F1/02F28F3/02G06F1/20H05K7/20
CPCH01L2924/0002H01L23/473G06F1/203F04D29/582H01L2924/00
Inventor 畑由喜彦富冈健太郎
Owner KK TOSHIBA