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Method of protecting chip front face pattern and method of implementing two-side technology

A wafer and pattern technology, which is applied in the field of double-sided technology with the function of protecting the pattern on the front side of the wafer

Inactive Publication Date: 2010-05-05
TOUCH MICRO SYST TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Therefore, the object of the present invention is to provide a method for protecting the pattern on the front side of the wafer and a method for the double-sided process with the function of protecting the pattern on the front side of the wafer, so as to improve the insurmountable problems of the prior art

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  • Method of protecting chip front face pattern and method of implementing two-side technology
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  • Method of protecting chip front face pattern and method of implementing two-side technology

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Embodiment Construction

[0023] Please refer to Figure 4 to Figure 10 . Figure 4 to Figure 10 It is a schematic diagram of a method for protecting the pattern on the front side of a wafer according to a preferred embodiment of the present invention. Such as Figure 4 As shown, a wafer 50 is first provided, which includes a front side 52 and a back side 54 . In addition, the front surface 52 of the above-mentioned wafer 50 has previously been formed with a front surface pattern 56 by a front surface process, such as deposition, photolithography and etching, and the front surface pattern 56 includes a plurality of holes 56A and 56B with different aspect ratios. Such as Figure 5 As shown, a low viscosity fluid 58 is then formed on the front side 52 of the wafer 50 by coating or other means. The viscosity of the low viscosity fluid 58 is preferably between 10 and 50 centipoise, and more preferably 20 centipoise. In this embodiment, the low-viscosity fluid 58 is selected from the photoresist soluti...

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Abstract

The present invention discloses one method of protecting the chip pattern in the front side and one double-sided technological process. The technological process includes the first providing one chipwith one front side with pattern possessing several holes and one back side; the subsequent forming one low viscosity fluid in the front side and filling the low viscosity fluid into the holes; and final forming one high viscosity fluid in the front side and filling the high viscosity fluid into the holes.

Description

technical field [0001] The invention relates to a method for protecting the pattern on the front surface of a wafer, in particular to a method for double-sided technology with the function of protecting the pattern on the front surface of the wafer. Background technique [0002] Micro-electromechanical (MEMS) components, such as micro sensors, micro actuators, and micro microphones, have more complex mechanical design structures than semiconductor components, such as rotating shaft structures and Separator (diaphragm) structure, etc., therefore often must use the double-sided process to complete. However, because the double-sided process is not a standard semiconductor process, it often faces many difficulties in production. For example, when performing a double-sided process, a front-side pattern is first formed on the front side of the wafer using a front-side process including deposition, photolithography, and etching, and then the wafer is turned over and a back-side pa...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/02B81C1/00
Inventor 陈臆如
Owner TOUCH MICRO SYST TECH