RF circuit with stacked printed circuit boards

A technology of substrate and conductive interconnection, applied in the field of RF circuits, can solve the problems of limited design and manufacturing costs, small space, and having to be replaced, and achieve good effects of mechanical shock and vibration

Inactive Publication Date: 2007-02-21
THOMSON LICENSING SA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This approach has limitations in terms of design and manufacturing expense, as smaller components are generally more expensive and existing manufacturing equipment may become obsolete and have to be replaced
Additionally, smaller components have less space between them, potentially increasing unwanted crosstalk and RF interference

Method used

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  • RF circuit with stacked printed circuit boards
  • RF circuit with stacked printed circuit boards
  • RF circuit with stacked printed circuit boards

Examples

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Embodiment Construction

[0026] Throughout the drawings, schematic representations of components and substrates are shown. These components are for illustrative purposes only and do not limit the scope of the present invention.

[0027] figure 1 An exploded perspective view of an embodiment of an RF unit according to the invention is shown. The RF unit as a whole is identified with reference number 1 . The RF unit 1 comprises, an RF switch and an RF splitter or circulator 2 , a first tuner 3 and an IF and analog demodulator 4 on a first substrate 7 . A second tuner or remodulator 5 and a demodulator 6 are arranged on a second substrate 8 . The first substrate 7 is mounted on figure 1 In the upper part of the housing 9, it is preferably made of sheet metal to shield against electromagnetic radiation. exist figure 1 In , the housing 9 is shown inverted. In a preferred embodiment, the housing 9 is made from a piece of metal which is cut and bent to form a rectangular tube with one or two open majo...

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PUM

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Abstract

An RF unit comprises a tuner, a demodulator and a mixer. At least the tuner and the mixer are disposed on separate first and second substrates. The RF unit further comprises a housing accommodating the first and second substrates. The first substrate and the second substrate are arranged on different levels inside the housing and maintain a predetermined distance between each other. <IMAGE>

Description

technical field [0001] The present invention relates to RF circuits. In particular, the present invention relates to an RF circuit comprising a tuner, a demodulator and a mixer, wherein at least the tuner and the mixer or demodulator are provided on separate tuner and mixer or demodulator substrates. The unit also includes a housing housing some or all of the components of the RF circuitry. Background technique [0002] The importance of digital networks for distributing content like computer data, video programs, audio programs, etc. is growing strongly. Devices for receiving digital data are provided with a so-called front end, which is a key component eg in digital set-top boxes or television receivers. This front end is also called a Network Interface Module (NIM). It can now be seen that there is a steady demand to reduce the size of the NIM while increasing the integrated functions and the number of interface pins. [0003] A common approach to meeting these requir...

Claims

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Application Information

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IPC IPC(8): H05K5/00H05K1/14H05K7/14H05K9/00
CPCH05K9/002H05K1/144H05K7/1417
Inventor 郑添发林莉蓉林锋
Owner THOMSON LICENSING SA
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