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Laser processing method and object to be processed

A laser processing method and laser technology, used in metal processing, laser welding equipment, metal processing equipment, etc., can solve problems such as thermal influence and functional component pollution

Active Publication Date: 2007-03-28
HAMAMATSU PHOTONICS KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

This is because, when the modified region is formed inside the laminated part, there is a possibility of causing adverse effects such as contamination and thermal influence on the functional elements included in the base part.

Method used

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  • Laser processing method and object to be processed
  • Laser processing method and object to be processed
  • Laser processing method and object to be processed

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Experimental program
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Effect test

no. 1 Embodiment approach

[0133] Next, a first embodiment of the present invention will be described. 14 is a plan view of the object to be processed in the laser processing method according to the first embodiment, and FIG. 15 is a partial cross-sectional view along line XV-XV of the object to be processed shown in FIG. 14 .

[0134] As shown in FIGS. 14 and 15 , the object 1 has a substrate 4 having a silicon structure, and a multilayer portion 16 including a plurality of functional elements 15 formed on the surface 3 of the substrate 4 . The functional element 15 has an interlayer insulating film 17a laminated on the surface 3 of the substrate 4, a wiring layer 19a disposed on the interlayer insulating film 17a, and is laminated on the interlayer insulating film 17a so as to cover the wiring layer 19a. The interlayer insulating film 17b and the wiring layer 19b disposed on the interlayer insulating film 17b. The wiring layer 19a is electrically connected to the substrate 4 through the conductive pi...

no. 2 Embodiment approach

[0157] Next, a second embodiment of the present invention will be described. The laser processing method of the second embodiment differs from the laser processing method of the first embodiment in the method of forming the modified region on the substrate 4 of the object 1 .

[0158] That is, as shown in FIG. 25 , a plurality of planned cutting lines 5 a extending in a direction perpendicular to and parallel to the surface 6 are set to pass between the functional elements 15 and 15 at intervals between a plurality of columns of functional elements. Moreover, a plurality of planned cutting lines 5b extending in a direction perpendicular to the surface 6 are set so as to pass between the functional elements 15 and 15 that are not set with the planned cutting line 5a, so as to pass through the functional elements 15 that are not set with the planned cutting line 5a. The manner between the functional elements 15 and 15 sets a plurality of predetermined cutting lines 5c extending ...

no. 3 Embodiment approach

[0165] Next, a third embodiment of the present invention will be described. The laser processing method of the third embodiment is different from the laser processing method of the first embodiment in the method of expanding the stretching band 23 .

[0166] That is, as shown in Figure 28, on the spacing of a plurality of rows of functional elements, set a plurality of predetermined cut-off lines 5a extending in a direction perpendicular to the surface 6 in the manner of passing between the functional elements 15 and 15. A plurality of planned cutting lines 5 b extending in a direction parallel to the surface 6 are set to pass between the functional elements 15 and 15 at intervals of a plurality of columns. And, set a plurality of planned cutting lines 5c extending in a direction perpendicular to the surface 6 so as to pass between the functional elements 15 and 15 that are not set with the planned cutting line 5a, so as to pass through the non-set planned cutting line 5b. A ...

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PUM

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Abstract

A laser processing method, by which a stacked part can be highly accurately cut with a substrate, at the time of cutting the substrate, whereupon the stacked part including a plurality of function elements is formed, into a plurality of chips having the function elements. In this laser processing method, modified areas, which have different breakage generating performance to the substrate (4), are formed along each of cut planned lines (5a)-(5d). Therefore, when an expand tape is stuck on the rear surface of the substrate (4) and is expanded, an object(1) to be processed is cut step by step into a plurality of semiconductor chips. Such step-by-step cutting permits uniform tensile stress to operate on the parts along each of the cut planned lines (5a)-(5d). As a result, an interlayer insulating film on the cut planned lines (5a)-(5d) can be highly accurately cut with the substrate (4).

Description

technical field [0001] The present invention relates to a laser processing method and an object to be processed used for cutting a substrate on which a laminated portion including a plurality of functional elements is formed. Background technique [0002] As such a conventional technique, the following laser processing method is described in the following patent document 1. That is, by attaching a member to protect the surface of the flat object to be processed, and irradiating the laser beam on the back surface of the object to be processed as the laser incident surface, a cutting start region generated by a modified region is formed inside the object along the planned cutting line . Next, by attaching a stretchable film to the back surface of the object to be processed and stretching the stretchable film, a plurality of parts generated by cutting the object to be processed starting from the cutting start area are separated from each other. [0003] Patent Document 1: Jap...

Claims

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Application Information

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IPC IPC(8): H01L21/301B23K26/00B23K101/40B23K26/38
CPCB23K33/002B23K26/0057B23K2201/36B23K26/4075B23K26/40B23K26/53B23K2101/36B23K2103/50B23K2103/56
Inventor 坂本刚志村松宪一
Owner HAMAMATSU PHOTONICS KK