Device and method for joining substrates

A substrate and sealing substrate technology, applied in the direction of semiconductor/solid-state device components, semiconductor devices, electrical components, etc., to achieve the effect of improving efficiency and preventing contamination
CN1938845AInactive Publication Date: 2007-03-28FUJIFILM CORP
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
FUJIFILM CORP
Publication Date
2007-03-28
Estimated Expiration
Not applicable · inactive patent

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Abstract

A device for joining substrates (11) is provided inside a clean booth (12). a single axis robot (46) and a five axis robot (47) convey a wafer (25) and a glass substrate (33). A transcribing station (91) obtains a transcribing film (112) on which adhesive is applied from a film supplying section (113), and presses the transcribing film (112) to the glass substrate (33) so as to transcribe the adhesive to the glass substrate (33). A peeling station (92) peels the transcribing film (112) from the glass substrate (33). A joining station (57) positions the wafer (25) and the glass substrate (33), adjusts parallelism of joining surfaces of the wafer (25) and the glass substrate (33), and joins these substrates together. Since the handling and the joining of the wafer (25), the glass substrate (33) and the transcribing film (112) are performed in the clean booth, it is prevented that a yield ratio of the product decreases because of the adhesion of foreign matters.
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Description

technical field

[0001] The present invention relates to an apparatus and method for bonding semiconductor substrates and sealing substrates in the manufacture of chip-sized packages. Background technique

[0002] Digital cameras and digital video cameras having solid-state imaging devices such as CCDs and CMOSs ​​are widely used. A semiconductor substrate in a conventional solid-state imaging device, that is, an image sensor chip, is contained in a package and sealed by transparent glass ribs. However, solid-state imaging devices are required to be downsized due to an increase in demand for mobile phones having a function of carrying images and the like.

[0003] Wafer level chip size packaging (hereinafter referred to as WLCSP) is a packaging method for downsizing a solid-state imaging device. In the semiconductor wafer process, when the packaging is completed, the semiconductor devices in the WLCSP are obtained by dicing the wafer by scribing. A solid-state imaging devi...

Claims

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