Conduction system applicable to plating equipment

Abstract

This invention relates to the conductive system of electroplating equipment. The system is composed of a copper conductive rod, conductive wires, and a conductive heat fixation cannula. The copper conductive rod is connected with the power supply. Besides, the copper conductive rod is also connected with the iron frame through the conductive heat fixation cannula via conductive wires, and throughthe power shaft of the roll frame, and is fixed on the wall. The conductive system can continuously supply electricity for work pieces during the electroplating, and does not limit the motion of workpieces. Besides, the conductive system is simple and convenient.

Description

technical field [0001] The invention relates to a conductive system, in particular to a conductive system mainly used in electroplating equipment. Background technique [0002] Today's electroplating process requires that the workpiece to be plated must be electrically charged during the electroplating process. There are currently two main ways to energize the workpiece, but both belong to the fixed point conduction method. One is that the static workpiece conducts electricity, that is, the processed The workpiece is placed statically in the electroplating pool, and the electroplating solution or the workpiece itself can be electrified to ensure the success of electroplating. However, this technology is increasingly unsuitable for the requirements of electroplating accuracy. In occasions with high requirements, the above-mentioned processing methods obviously cannot meet the requirements due to the gravity of the workpiece itself and the electroplating solution; the second i...

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Problems solved by technology

[0002] Today's electroplating process requires that the workpiece to be plated must be electrically charged during the electroplating process. There are currently two main ways to energize the workpiece, but both belong to the fixed point conduction method. One is that the static workpiece conducts electricity, that is, the processed The workpiece is placed statically in the electroplating pool, and the electroplating solution or the workpiece itself can be electrified to ensure the success of electroplating. However, this technology is increasingly unsuitable for the requirements of electroplating accuracy. In occasions with high requirements, the above-mentioned processing methods obviously cannot meet the requirements due to the gravity of the workpiece itself and the electroplating solution; the second is that for a regular geometric body with regular motion, the workpiece can be continuously energized at a fixed point, and the workpiece can be transferred to a certain Do simple gyrating motion or rocking motion in a specific direction, that is, electrify on a specific point of the workpiece with regular geometry to ensure that the point does not move with the motion of the workpiece, and the continuous motion of the workpiece can evenly spread the electroplating solution to ensure the uniformity of the electroplating layer , but this technology still has insurmountable difficulties. For example, its scope of application is small, and since the workpiece can only move regularly, at least one surface cannot be uniformly plated. According to the principle of general movement, it is not difficult to conclude that only when the workpiece Able to perform irregular movements in all directions, electroplating can get a uniform coating on the entire surface of the workpiece, but if the workpiece performs irregular movements, it will become troublesome to energize the workpiece, because with the movement of the workpiece itself , the wires necessary for electrification must also move accordingly, so it is easy to be entangled and bring danger to production. Therefore, the existing technology needs to be further improved

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