Liquid-cooling type electronic-device radiator

An electronic device and cooling technology, which is applied in the direction of electric solid device, semiconductor device, cooling/ventilation/heating transformation, etc., can solve the problems of high cost and complex system, and achieve the effect of simple processing, compact device structure and material saving

Inactive Publication Date: 2007-06-13
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to overcome the deficiencies of the existing liquid cooling technology such as complex system and high cost, and provide a liquid-cooled electronic device radiator with compact integration, stable operation and high heat exchange efficiency

Method used

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  • Liquid-cooling type electronic-device radiator
  • Liquid-cooling type electronic-device radiator

Examples

Experimental program
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Effect test

Embodiment Construction

[0022] As shown in Figure 1, the main body of the liquid-cooled radiator includes a cooling fan 1, a cover plate 2, a high-efficiency heat sink 3, a connecting pipe box 4, a base plate 5, a hose 6, and a micro pipeline pump 7. The substrate 5 is made of a red copper plate with a thickness of 3-5 mm, which is rolled and formed according to the assembly requirements of electronic devices. As shown in Figure 2, the high-efficiency heat sink 3 is a semicircular or semi-elliptical copper tube cut in half, and eight high-efficiency heat sinks 3 are fixed on the substrate 5 in parallel, and the high-efficiency heat sink 3 has three-dimensional fins on the outside . The high-efficiency heat sink 3, the connecting pipe box 4 and the base plate 5 are fully welded. Purified water is used as the cooling liquid, driven by the micro pipeline pump 7 to circulate in the closed flow channel formed between the high-efficiency heat sink 3 and the base plate 5 . Electronic device chip heating p...

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PUM

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Abstract

The invention makes public a kind of electronic appliances radiator in a liquid-cooled type, several parallel high efficient radiating ribs in striped type that are fixed on the baseplate, one end of the said striped type high efficient radiating ribs are connected with one through connection tube box, the other is connected with one connection tube box that are divided into two boxes, the said two boxes are connected with one subminiature pipe pump through hose respectively, the said subminiature pump is also fixed onto the baseplate, the baseplate, striped type high efficient radiating rib, connection tube box, subminiature pipe pump and the hose forms an closed flow channel, the said closed flow channel is filled in the cooling fluid, a closed circulation flow in the flow channel is formed between the radiating ribs and the baseplate when the cooling liquid is driven by the subminiature pipe pump,. The structure of the electronic appliances radiator that is opened by the invention is compact, which increases the heat exchange area effectively, and improves the radiating efficiency of radiator. The invention can be used widely to eliminate heat for all kinds of high power electronic appliances, such as graphics accelerator card, CPU and others.

Description

technical field [0001] The invention relates to the heat dissipation technology of electronic devices, in particular to a liquid cooling radiator for electronic devices. Background technique [0002] Electronic devices and chips need to work under certain temperature conditions. At the same time, electronic devices will generate a certain amount of heat when they are working, making their temperature continue to rise. The normal operating temperature range of electronic devices is generally -5~+65°C, and the maximum allowable operating temperature is 100~120°C. Too high or too low temperature will reduce the performance of electronic devices, and even cause damage to the device. To control electronic products to work within a certain temperature range, it is necessary to preheat and dissipate heat for some overheated chips or overheated device surfaces. With the rapid development of electronic technology, the high frequency and high speed of electronic devices and the dens...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H01L23/473
Inventor 高学农张正国陆应生方玉堂方晓明
Owner SOUTH CHINA UNIV OF TECH
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