Transfer equipment

Abstract

Transfer equipment (10) is provided with a supporting plate (11) which has a supporting plane (20A) for a semiconductor wafer (W), an arm plate (30) for supporting the supporting plate, and a parallelism adjusting means (14) arranged between the supporting plate and the arm plate (13). The supporting plate is arranged to permit air to be sucked and discharged from the supporting plane, is maintained parallel to the wafer by the reaction when the supporting plate is brought close to the semiconductor wafer (W) in a status where air is discharged. After the supporting plate is brought into contact with the wafer in a status where the parallelism is maintained, the supporting plate sucks the wafer and transfers it.

Description

technical field [0001] The present invention relates to a transfer device, and particularly relates to a transfer device suitable for suction transfer without damaging a brittle plate-shaped object such as a semiconductor wafer ground to an extremely thin state. Background technique [0002] As a semiconductor wafer (hereinafter simply referred to as "wafer") on which a circuit surface is formed, it is necessary to perform heat-sensitive adhesive bonding for die bonding on the back side with a protective tape attached to the circuit surface. A series of processing such as splices, and then installed on the ring frame. Such a device for performing a series of processes is disclosed in Patent Document 1, for example. [0003] In Patent Document 1, an arm-type transfer device is used as a device for transferring a wafer to each process. In this transfer device, a suction unit is provided on the front end side of the arm, and the wafer can be supported and transferred to a pre...

AI Technical Summary

Problems solved by technology

[0005] However, in the structure disclosed in Patent Document 1, only the front end side of the arm is moved to push the suction portion onto the wafer for suction and holding when transferring the wafer, which causes the following problems

[0006] That is, recent wafers, for example, are ground to a thickness of tens of μm order, so when the parallelism between the support surface of the support plate and the wafer surface deviates, that is, when a slight inclination occurs, there is a gap between the support plate and the wafer surface. When the surfaces of the wafers are in contact, a local load may be applied to the wafer, which may cause damage such as scratches or cracks on the wafer, causing such abnormal problems

In addition, it is very difficult to assemble the device while maintaining the parallelism of the support plate with respect to the wafer with high precision. At the same time, the accuracy of the components used is also strictly required, which also brings a heavy burden in terms of cost.

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