Method and device for producing a galvanic layer on a substrate surface

Abstract

A method and a device are described for producing a galvanic layer having a defined spatial extent on an electrically conductive substrate surface having any shaped contour at all. In this context, an electrolyte jet from a nozzle is applied to the substrate, and a current flows between the nozzle and the substrate surface essentially via the electrolyte jet. The device is provided with a pump for delivering an electrolyte from an electrolyte reservoir to the nozzle and for producing an electrolyte jet directed at the substrate surface. Moreover, the device has a reactor in which are arranged the substrate to be coated, as well as the nozzle. The substrate and the nozzle are connected to a direct current source, and a configuration of the substrate and of the nozzle in the reactor is variable during the coating process.

Description

BACKGROUND INFORMATION[0001] The present invention is directed to a method and a device for producing a galvanic layer having a defined spatial extent on an electrically conductive substrate surface.[0002] Generally, galvanically produced layers which are applied precisely to a limited area of a substrate surface, are described as partial precision layers. The galvanic layers having limited spatial dimensions are produced by selectively influencing a current flow in an electrolyte between an anode and the substrate to be coated, in a generally known way, using screening.[0003] It is additionally provided in the case of a so-called mask technique, to provide the substrate surface to be coated, for example, with a photosensitive resist, which stops a current flow between the anode and the substrate in this region and prevents a deposition of coating material.[0004] The known devices in which the galvanic coating processes take place have the disadvantage, however, of being tailored to...

AI Technical Summary

Benefits of technology

The present invention provides a method and device for producing galvanic layers on electrically conductive substrate surfaces with any shaped contour at all. This is achieved by applying an electrolyte jet to the substrate surface, where the nozzle and substrate surface are variable during the coating process. This method does not require costly process-preparation production steps and is more flexible and adaptable to new conditions compared to known coating techniques. The device for producing a galvanic layer has a pump for delivering electrolyte and a reactor with a direct current source connected to the substrate and nozzle, making it easy to produce patterned contour or profile galvanic layers on any substrate surface.

Problems solved by technology

The known devices in which the galvanic coating processes take place have the disadvantage, however, of being tailored to the geometric form of the particular substrate to be coated, and also of requiring replacement or retrofitting when another substrate or component type is to be coated.

This leads disadvantageously to the situation where using devices and methods known in the field for producing a galvanic layer on a substrate surface, for the most part, a contour layer having a constant layer thickness can be applied, a surface contour of the substrate surface being identically replicated by the galvanic contour layer, and a profile layer, which, in its spatial extent, has a variable layer thickness, being only able to be produced with considerable cost for equipment.

However, this device known from the related art has the disadvantage that, prior to producing a patterned galvanic layer, it is necessary to prepare the substrate to be coated, i.e., its surface, or the area surrounding the substrate, i.e., the device itself, in accordance with the layer to be produced.

However, such process-preparation production steps entail considerable outlay and increase the production costs related to the coated substrates and / or components.

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