Signal transmission plate used in an assembly package

Abstract

A signal transmission plate used in an assembly package includes at least one insulating layer, at least one layout wire layer formed on the insulating layer, and a solder mask layer formed on the layout wire layer. The solder mask layer exposes partial area of the layout wire layer at the center and peripheries of the signal transmission plate to form a plurality of die bonding pads and a plurality of wire bonding pads.

Description

[0001] This is a Divisional application claiming priority under 35 U.S.C. .sctn.120, of co-pending prior application Ser. No. 10 / 293,123 filed on Nov. 12, 2002, the disclosure of which is incorporated herein by reference.[0002] 1. Field of the Invention[0003] The invention relates to a signal transmission plate used in an assembly package.[0004] 2. Description of the Related Art[0005] During the recent years, due to the steady increase of demand of consumer electronic products, namely, cellular phones, personal digital assistants (PDAs) and digital cameras, package structures are developed toward being light in weight and small in size with short signal transmission distances. Based upon such trend, in order to save package area as well as to improve problems such as signal distortion, delay or power loss, an assembly package integrates at least one die into a same package structure by perpendicular stacking.[0006] Referring to FIG. 1, a conventional ball grid array (BGA) package 1 ...

AI Technical Summary

Benefits of technology

[0011] The assembly package of the invention employs flip-chip bonding, so that the signals from the first die (the bottom die) are transmitted to the substrate. Therefore, imperfect electricity caused by using lead connection is prevented. Also, the second die also utilizes flip-chip bonding so that the signals are transmitted to the signal transmission plate and then to the substrate via the conductive wires. As a result, the conductive wires are not required to connect to the joints on the top die; only the signal transmission plate is needed to connect with the wire bonding pads, and signals from the top die can be transmitted to the substrate. In other words, the signal transmission quality is improved, and the signal transmission rate is also increased, for that the transmission distance of the conductive wires is shortened.

Problems solved by technology

Nevertheless, by using conductive wires to electrically connect I / O pins of individual die with the substrate for signal transmission, the signal transmission quality of the die may be affected by the transmission distance and the number of conductive wires.

However, the longer the transmission distance of conductive wires gets, the noise increases accordingly, and the signal distortion and hysteresis become more apparent, thereby dropping the signal transmission quality.

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