Pump, cooler, and electronic device
a technology of electronic devices and coolers, applied in the direction of positive displacement liquid engines, piston pumps, liquid fuel engines, etc., can solve the problems of affecting the performance of the pump, the liquid coolant in the pump chamber is more likely to evaporate or leak, and the manufacturing cost of die casting is higher than manufacturing
Inactive Publication Date: 2005-11-03
KK TOSHIBA
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Benefits of technology
The invention relates to a cooling system for electronic devices that use a liquid coolant to cool heat-generating components such as CPUs. The system includes a pump and a cooler with a contact-heat-exchange pump. The cooler has a casing cover that is made of a high thermal conductivity material, such as copper or aluminum, to accelerate heat transfer. The system is designed to prevent leakage or evaporation of the coolant from the components themselves or through sealed portions between the pump casing and the casing cover. The invention also includes a portable computer with a liquid coolant system and a display panel with a liquid crystal display panel. The technical effects of the invention include improved cooling efficiency, reduced leakage or evaporation of coolant, and improved display quality.
Problems solved by technology
The die cast manufacturing costs tend to be higher than manufacturing using resin injection molding.
In the configuration where the pump casing, the casing cover, and the like components are made of resin, however, with the loss of coolant is more likely to occur than the configuration where the pump casing, the casing cover, and the like components made of copper or aluminum.
More specifically, liquid coolant in the pump chamber is more likely to, for example, evaporate or leak from the components themselves or through sealed portions between the pump casing and the casing cover.
Method used
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[0017] An embodiment of the present invention will be described below with reference to FIGS. 1 to 6.
[0018]FIGS. 1 and 2 show a portable computer 1 as being an electronic device. The portable computer 1 has a computer main body 2 and a display unit 3. The computer main body 2 has a first housing 10. The first housing 10 has a bottom wall 11a, an upper wall 11b, a front wall 11c, left and right sidewalls 11d and 11e, a rear wall 11f.
[0019] Referring to FIG. 1, the upper wall 11b has a palm rest 12 and a keyboard mounting portion 13. The keyboard mounting portion 13 is provided in a rear portion of the palm rest 12. A keyboard 14 is mounted in the keyboard mounting portion 13. The front wall 11c, the left and right sidewalls 11d and 11e, and the rear wall 11f form a peripheral wall along the periphery of the first housing 10. With reference to FIG. 2, a plurality of exhaust openings 15 are formed in a peripheral wall of the first housing 10, such as the rear wall 11f. The exhaust op...
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According to one embodiment, a pump housing comprises a heat receiving plate which is thermally coupled to a CPU, and a pump chamber. An impeller to be rotated by a motor is provided in the pump chamber. At least a part of the pump housing is made of resin containing at least one of metal filler, filler of material having lower linear expansion coefficient than the resin, and filler of material having lower water-vapor transmissivity than the resin.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS [0001] This application is based upon and claims the benefit of priority from the prior Japanese Patent Application No. 2004-133536, filed Apr. 28, 2004, the entire contents of which are incorporated herein by reference. BACKGROUND [0002] 1. FIELD [0003] Embodiments of the invention relate to a pump implemented in a cooler of a liquid cooling type that cools heat-generating elements such as a central processing unit (CPU) by using a liquid coolant. The invention further relates to a cooler having the pump and to an electronic device having the cooler. [0004] 2. DESCRIPTION OF THE RELATED ART [0005] With enhancement in processing speed and multi-functionality, CPUs for use in electronic devices are generating an increased amount of heat during operation. In recent years, by way of a countermeasure for such heat generation, electronic devices have been put into practice that cool a CPU by using a liquid coolant having a specific heat coefficient...
Claims
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IPC IPC(8): F04D29/22F04B17/00F04B35/04F04D5/00F04D29/02F04D29/42F04D29/58H05K7/20
CPCF04D29/426F04D29/026F05D2300/43F05D2300/615
Inventor TOMIOKA, KENTAROHATA, YUKIHIKO
Owner KK TOSHIBA