Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Insulation paper with high thermal conductivity materials

a technology of thermal conductivity and insulation paper, which is applied in the direction of plastic/resin/waxes insulators, soldering devices, manufacturing tools, etc., can solve the problems of reducing the efficiency and durability of components as well as the equipment as a whole, and other problems of the prior art, etc., to achieve high thermal conductivity, facilitate the thermal conductivity of insulating paper, and high electrical resistivity

Inactive Publication Date: 2005-12-15
SIEMENS ENERGY INC
View PDF17 Cites 50 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0007] With the foregoing in mind, methods and apparatuses consistent with the present invention, which inter alia facilitates the thermal conductivity of insulating paper by intercalating high thermal conductivity (HTC) materials onto and / or into the host matrix of the insulating paper. The HTC materials of the present invention can be of a variety of types, such as nanofillers or surface coatings, and both nanofillers and surface coatings each comprise various sub-groups unto themselves. The HTC materials can be added to the paper at a variety of stages, such as when the paper is in its raw materials, or substrate, stage, when the paper is being formed, or after the paper has been formed. Mica is a particular kind of substrate for insulating paper due to its high electrical resistivity.

Problems solved by technology

Good electrical insulators, by their very nature, also tend to be good thermal insulators, which is undesirable.
Thermal insulating behavior, particularly for air-cooled electrical equipment and components, reduces the efficiency and durability of the components as well as the equipment as a whole.
Other problems with the prior art also exist, some of which will be apparent upon further reading.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0018] The present invention provides for the incorporation of high thermal conductivity (HTC) materials into and onto the substrate used in paper insulation, such as the types used in electrical insulating tapes. Insulating tapes tend to comprise a host matrix, such as mica, that is formed into a paper, that is often then impregnated with resin or accelerator or both. Before or after being impregnated, the paper used in tapes is added to a high tensile strength backing, such as glass or polymer film. The host matrix of an insulating tape acts as a very good electrical insulator, but also insulates thermally as well, which is an undesired side effect.

[0019] It is therefore desired to increase the thermal conductivity of the substrate. As used herein substrate refers to the host material that the insulating paper is formed from, while matrix refers to the more complete paper component made out of the substrate. These two terms may be used somewhat interchangeable when discussing the...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
resistivityaaaaaaaaaa
aspect ratioaaaaaaaaaa
aspect ratiosaaaaaaaaaa
Login to View More

Abstract

The present invention provides for a high thermal conductivity (HTC) paper that comprises a host matrix, such as mica, and HTC materials intercalated into the host matrix. The HTC materials are comprised of at least one of nanofillers, diamond like coatings directly on the host matrix, and diamond like coatings on the nanofillers.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS [0001] This application claims priority to U.S. provisional 60 / 580,023, filed Jun. 15, 2004, by Smith, et al., which is incorporated herein by reference. This application is further related to US patent application “Fabrics with High Thermal Conductivity Coatings” filed herewith, by Smith, et al., which is also incorporated herein by reference.FIELD OF THE INVENTION [0002] The field of the invention relates to increasing the thermal conductivity of paper used in electrical insulation. BACKGROUND OF THE INVENTION [0003] With the use of any form of electrical appliance, there is a need to electrically insulate conductors. With the push to continuously reduce the size and to streamline all electrical and electronic systems there is a corresponding need to find better and more compact insulators and insulation systems. [0004] Good electrical insulators, by their very nature, also tend to be good thermal insulators, which is undesirable. Thermal in...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(United States)
IPC IPC(8): D21H13/44D21H17/67H01B3/52H01B3/54
CPCD21H13/44D21H17/67H01B3/52H01B3/54Y10T428/256Y10T428/251Y10T428/25D21H5/186
Inventor SMITH, JAMES D.STEVENS, GARYWOOD, JOHN W.
Owner SIEMENS ENERGY INC
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products