Thin film transistor and method for fabricating the same

Abstract

A thin film transistor that has improved characteristics and uniformity is developed by uniformly controlling low concentration of crystallization catalyst and controlling crystallization position so that no seed exists and no grain boundary exists, or one grain boundary exists in a channel layer of the thin film transistor. The thin film transistor includes a substrate; a semiconductor layer pattern which is formed on the substrate, the semiconductor layer pattern having a channel layer of which no seed exists and no grain boundary exists; a gate insulating film formed on the semiconductor layer pattern; and a gate electrode formed on the gate insulating film. A method for fabricating the thin film transistor includes forming an amorphous silicon layer on a substrate; forming a semiconductor layer pattern having a channel layer in which no seed exists and no grain boundary exists by crystallizing and patterning the amorphous silicon layer; forming a gate insulating film on the semiconductor layer pattern; and forming a gate electrode on the gate insulating film.

Description

CROSS REFERENCE [0001] This application claims priority to and the benefit of Korean Patent Application No. 10-2004-0050915, filed on Jun. 30, 2004, the content of which is incorporated herein by reference in its entirety. BACKGROUND OF THE INVENTION [0002] 1. Field of the Invention [0003] The present invention relates to a thin film transistor and a method for fabricating the same, more particularly, to a thin film transistor having a channel layer of which no seed exists and no grain boundary exists, or one grain boundary exists, and a method for fabricating the thin film transistor. [0004] 2. Description of Related Art [0005] Generally, a polycrystalline silicon layer is used for various purposes as a semiconductor layer for a thin film transistor. For example, since the polycrystalline silicon layer has a high electric field effect and mobility, it can be applied to circuits operated at high speed, and it enables Complementary Metal Oxide Semiconductor (CMOS) circuit to be const...

AI Technical Summary

Benefits of technology

[0011] It is an aspect of the present invention to provide a thin film transistor for uniformly controlling a concentration of a crystallization catalyst and a crystallization position so that no seed exists and no grain boundary exists in a channel layer of the thin film transistor or for controlling the number of seeds or grain boundaries so that characteristics and uniformity of the thin film transistor are improved, and a method for fabricating the thin film transistor.

Problems solved by technology

In case of the laser annealing, while it can be performed at low temperature, and can result in high electric field effect and mobility, many alternative technologies are being studied because of the requirement for expensive laser equipment.

Regardless of its category, however, the crystallization method using metal has the problem that characteristics of elements for thin film transistors are deteriorated by metal contamination.

However, even in this case, there are problems in aspects of scale-up of grain size and uniformity of grain in the polycrystalline silicon layer.

However, the foregoing method has problems in that it is difficult to uniformly control low concentration of crystallization catalyst and control crystallization position and grain size.

Particularly, the foregoing method has problems in that it is difficult to control the number of boundaries between the seeds and the grains since characteristics and uniformity of elements for thin film transistors are greatly influenced by the number of boundaries between seeds and grains formed in a channel of the thin film transistor.

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