Substrate transport apparatus and method, exposure apparatus and exposure method, and device fabricating method

Abstract

A substrate transport apparatus, which transports a substrate that has been exposed with an image of a pattern through a projection optical system and a liquid, comprises a substrate support member that supports the substrate, and a liquid removal mechanism that removes the liquid that has adhered to at least one of the substrate support member and at least a portion of the area of the rear surface of the substrate.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS [0001] This is a Divisional of U.S. patent application Ser. No. 11 / 398,603 filed Apr. 6, 2006, which in turn is a Continuation of International Application No. PCT / JP2004 / 014945 filed Oct. 8, 2004, which claims priority to Japanese Patent Application Nos. 2003-349549 and 2003-349552, both filed on Oct. 8, 2003. The disclosures of the aforementioned applications are incorporated herein by reference in their entireties.BACKGROUND OF THE INVENTION [0002] 1. Field of the Invention [0003] The present invention relates to a substrate transport apparatus and method, which transports a substrate that has been exposed by a liquid immersion method, an exposure apparatus and method, and a device fabricating method. [0004] 2. Description of Related Art [0005] Semiconductor devices and liquid crystal display devices are fabricated by a so-called photolithography technique, wherein a pattern formed on a mask is transferred onto a photosensitive substrate. A...

AI Technical Summary

Benefits of technology

This solution allows for reliable transportation of substrates post-exposure, preventing contamination and ensuring the desired performance of fabricated devices by effectively removing adhering liquids, thus maintaining cleanliness and preventing environmental changes.

Problems solved by technology

If the depth of focus δ becomes excessively narrow, then it will become difficult to align the surface of the substrate with the image plane of the projection optical system, and there will be a risk of insufficient margin of focus during the exposure operation.

At this time, if liquid has adhered to the rear surface of the substrate, then the liquid between the substrate transport member and the substrate forms a lubricating film, and the substrate becomes slippery (easily mispositioned) with respect to the substrate transport member, and there is a possibility of a problem arising wherein the substrate transport member will no longer be able to transport the substrate in the desired state.

In addition, if liquid has adhered to the substrate transport member, then that liquid forms a film that causes the substrate to slip with respect to the substrate transport member, and there is consequently a risk that the substrate cannot be transported satisfactorily.

If liquid has adhered to the substrate in the case where the substrate transport member holds the substrate by vacuum suction, then there is a possibility that a problem will arise wherein that liquid will infiltrate and damage the vacuum system.

In addition, if the transportation is executed in a state wherein liquid has adhered to the substrate and / or the substrate transport member, then problems arise, such as rusting of the various equipments and / or members in the vicinity of the transport pathway due to the liquid that falls from the substrate during transport, the inability to maintain the cleanliness level of the environment wherein the exposure apparatus is disposed, and the like.

If liquid has adhered to the substrate transport member, then there is a possibility that that liquid will adhere to and contaminate the substrate, and, if the liquid that has adhered to the substrate dries before the exposure process, then a trace thereof will remain on the substrate surface, which can cause a deterioration of the quality of the device that is manufactured.

In addition, there is a risk that, in a state wherein liquid has adhered to the substrate after the exposure process, for example, if the development process is executed, then it will cause uneven development and the like, and will also cause substrate contamination due to the liquid that has adhered to the substrate and that will collect impurities (dust and the like) present in the atmosphere, thus making it impossible to fabricate a device that has the desired performance.

Images