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Circuit pattern formation device and method of forming circuit pattern

a circuit pattern and formation device technology, applied in the field of circuit pattern formation devices and methods of forming circuit patterns, can solve the problems of increasing the resistance value of the formed circuit pattern, low mutual adhesiveness, pattern is easily damaged, etc., and achieves the effect of increasing the resistance value of the wiring

Inactive Publication Date: 2008-01-31
HITACHI LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention provides a method and device for forming a circuit pattern using electrophotographies at a high transfer efficiency while keeping the shape of the pattern. This method does not use a resin component that causes the increase of a resistance value of the obtained circuit pattern. The technical effects of this invention include high transfer efficiency, pattern shape retention, and reduced resistance value of wiring.

Problems solved by technology

However, if these resin components would exist in the conductive particle dispersed solution, the resin components remain in the pattern when the particles are converted into a conductor by heating and baking, and thereby causing the problem of increasing a resistance value of the formed a circuit pattern.
However, the developed particles have low mutual adhesiveness and the pattern is easily damaged by an external force.
As a result, the above method has a problem that a pattern shape cannot be kept due to a solvent flow occurring when the pattern is transferred onto an objective substrate.
The above method has also a problem of lowering the transfer efficiency of the electroconductive particles to be transferred onto the objective substrate, because the electrified electroconductive particles in a liquid interact with an electric charge remaining in a latent image on a photoreceptor.

Method used

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  • Circuit pattern formation device and method of forming circuit pattern
  • Circuit pattern formation device and method of forming circuit pattern
  • Circuit pattern formation device and method of forming circuit pattern

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Embodiment Construction

[0041]In order to achieve the above described purposes of the present invention, the present invention provides a method of transferring a circuit pattern precursor which has been formed from a conductive particle dispersed solution on a photoreceptor, comprising the steps of: temporarily removing a solvent remaining on a pattern right after the development, re-supplying the solvent to an circuit pattern precursor with an remaining electrostatic latent image on the photoreceptor, thereby re-electrifying the electroconductive particle pattern by an ion adsorption, and then transferring the pattern onto the objective substrate by an electrostatic force.

[0042]A transferring system according to the present invention can transfer a circuit pattern precursor composed of electroconductive particles onto an objective substrate while keeping a pattern shape at a high transfer efficiency, wherein the electroconductive particles do not include a resin component and can provide electric wiring ...

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Abstract

The purpose of the present invention is to provide a method for transferring a pattern of a circuit pattern precursor formed of electroconductive particles containing no resin component onto an objective substrate with high transfer efficiency while retaining a pattern shape. A method of transferring the circuit pattern precursor formed from an conductive particle dispersed solution on a dielectric thin film body includes the steps of: temporarily removing a liquid film remaining around the circuit pattern precursor right after a development step; subsequently re-electrifying the electroconductive particle pattern by supplying a solvent again to the circuit pattern precursor; and then electrostatically transferring the pattern onto the objective substrate through electrophoresis in the solvent.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to a circuit pattern formation device for forming a circuit pattern on a printed circuit board or the like, and a method of forming the circuit pattern.[0003]2. Background of the Invention[0004]Attention has been given to a system for forming a circuit pattern on a substrate by a printing process consisting of simple steps such as a screen printing process, a dispenser process, an inkjet printing process and an electrophotography printing process, as a substitutional technology for a conventional photolithographic system which needs an expensive mask and multistage process. Any of the processes forms a pattern by using a conductive particle dispersed solution containing electroconductive particles dispersed in a solvent, or a toner containing electroconductive particles added into a resin, and by applying the dispersion or the toner indirectly with a printing plate or a screen, directly wit...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): G03G13/14G03G15/14
CPCG03G15/1625G03G2215/00523H05K2203/0517H05K3/1266H05K3/207G03G2215/0629G03G15/225G03G15/6585
Inventor SANO, YUICHIROMIYASAKA, TORU
Owner HITACHI LTD