Heat-dissipation device having dust-disposal mechanism

a technology of heat dissipation device and dust dissipation mechanism, which is applied in the direction of cleaning heat dissipation device, non-rotary device cleaning, lighting and heating apparatus, etc., can solve the problems of significantly reducing the heat dissipation capability of the heat dissipation device, and the accumulation of dust in the air between the metallic fins of the cooling fin, so as to quickly remove waste heat and improve the heat dissipation capability of the heat dis

Inactive Publication Date: 2008-05-29
INVENTEC CORP
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  • Abstract
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  • Application Information

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Benefits of technology

[0016]The present invention adopts a cleaning unit having dust-disposal function to absorb or clear the dust on the metallic fins, such that the metallic fins of the heat-conducting module can keep cle

Problems solved by technology

It should be noted that after the heat-dissipation device is used for a long time, dust in the air is gradually accumulated between the metallic fins of the cooling fins.
If not being cleaned, excessive dust accumulated o

Method used

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  • Heat-dissipation device having dust-disposal mechanism
  • Heat-dissipation device having dust-disposal mechanism
  • Heat-dissipation device having dust-disposal mechanism

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Embodiment Construction

[0023]FIG. 1 is a schematic view of a heat-dissipation device having a dust-disposal mechanism according to an embodiment of the present invention. Referring to FIG. 1, the heat-dissipation device 100 mainly includes a heat-conducting module 110 and a dust-disposal mechanism 120, and the heat-conducting module 110 is used to dissipate heat for electronic devices with high heat-generating rate, so as to reduce the working temperature of the electronic devices in a system. The heat-conducting module 110 is generally made of metallic material with high heat conductivity such as Cu and Al, and is disposed on the electronic devices and connected to an air-cooling heat-dissipation module or a water-cooling heat-dissipation module in the system, so as to achieve the purpose of heat-dissipation.

[0024]In this embodiment, the heat-conducting module 110 includes a plurality of metallic fins 112 arranged in parallel, and the metallic fins 112 arranged in parallel are stacked with a gap G formed...

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Abstract

A heat-dissipation device having a dust-disposal mechanism for removing dust from cooling metallic fins is provided, which includes a heat-conducting module and a dust-disposal mechanism. The heat-conducting module has a plurality of metallic fins arranged in the same direction and apart with a gap formed therebetween. The dust-disposal mechanism has a cleaning unit corresponding to the metallic fins so as to insert into the gap between the metallic fins and clear or absorb the dust accumulated on the metallic fins, thereby enhancing the cooling efficiency of the heat-conducting module.

Description

CROSS-REFERENCE TO RELATED APPLICATION[0001]This application claims the priority benefit of Taiwan application serial no. 95143314, filed Nov. 23, 2006. All disclosure of the Taiwan application is incorporated herein by reference.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention relates to a heat-dissipation device, and more particularly to a heat-dissipation device having a dust-disposal mechanism.[0004]2. Description of Related Art[0005]Recently, with the rapid progress of computer science and technology, the operation speed of the computer is improved increasingly, and the heat-generating rate of electronic devices in the computer host is increased accordingly. In order to prevent overheat of the electronic devices in the computer host, which may result in temporary or permanent failure of electronic devices, a sufficient heat-dissipation performance must be provided for the electronic devices in the computer.[0006]Generally speaking, a heat-di...

Claims

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Application Information

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IPC IPC(8): F28G1/00
CPCF28D2021/0029F28G7/00F28G1/02F28D2021/0031
Inventor WANG, FRANKYANG, CHIH-KAI
Owner INVENTEC CORP
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