Mold shave apparatus and injection molded soldering process

a technology of injection molding and moulding, which is applied in the direction of metal working equipment, mold cavities, mold shave apparatus, etc., can solve the problems of inability to remove solder or alloys at room temperature, formation of empty or inadequate mold cavities, adversely affecting the integrity of any electronic device, etc., to facilitate the shaving of excess solder volume, adversely affecting the solder volume, and rapid operation

Inactive Publication Date: 2008-07-03
IBM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0011]In order to attain the foregoing, pursuant to the present invention, there is provided a unique apparatus which will facilitate the shaving of excess solder volumes from the surface of the mold without in any manner adversely affecting the solder volume which has already been filled into the mold cavities, by heating a shaving blade and mold plate.
[0012]In essence, the known injection molded solder transfer process cannot allow for the acceptance of large variations in solder bump volumes, and, consequently, by utilizing the inventive s

Problems solved by technology

Generally, in the current technology, which is concerned with the process of injection molding, it is readily acknowledged that some amounts of solder or alloys cannot be removed at room temperature without concurrently causing the removal of some solder which is filled in the mold cavities.
Various types of solder may also possess a weaker degree of adherence to the wall surfaces in the mold cavities, and the light pressure, which is normally needed to remove the solder bridging, streaking and contaminants from the surface of the mold may, at times, be enough so as to result in the formation of either empty or inadequately filled mo

Method used

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  • Mold shave apparatus and injection molded soldering process
  • Mold shave apparatus and injection molded soldering process

Examples

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Embodiment Construction

[0014]Referring to the shaving apparatus 10, there is disclosed a plate-like bottom support member 12 that has an upright bridge frame structure 14 beneath which there is located a movable table 16 adapted to be displaced in both x and y directions along the bottom support member 12 through the operation of a suitable operating and conveying structure (not shown).

[0015]Supported on the movable table 16 is a vacuum table 18, which enables the retention thereon of a large-sized mold plate 20 with a surface having a multiplicity of cavities or small holes (not shown) formed therein; each of which is adapted to be filled with a quantity of molten solder possessed of a precise volume of (C4) bumps, which are to be transferred to suitable wafer pads (not shown). As indicated, the mold plate 20 may be constituted of a borosilicate glass plate having the cavities etched therein, which represent the wafer (C4) pad locations and with cavity quantities ranging of from 100,000 to an excess of 1...

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Abstract

An apparatus and a method for the removal of excess solder or contaminant, which are encountered on the surfaces of injection mold prior to the transfer of a solder on a silicon wafer. More particularly, there is provided for the removal of excess solder, which may be present on a mold surface, without removing any solder, which is located in cavities formed in the mold, and wherein the solder is applied through an injection molded soldering process.

Description

BACKGROUND OF THE INVENTION[0001]Field of the Invention[0002]The present invention relates to an apparatus and to a method for the removal of excess solder or contaminant, which are encountered on the surfaces of injection mold prior to the transfer of a solder on a silicon wafer. More particularly, the present invention is directed to the removal of excess solder, which may be present on a mold surface, without removing any solder, which is located in cavities formed in the mold, and wherein the solder is applied through an injection molded soldering process.[0003]During the application of quantities of molten solder over the surface of a mold plate possessing cavities which are adapted to be filled with the molten solder, wherein the cavities represent wafer controlled collapse chip connecting (C4) pad locations, quite frequently the surface of the mold is subject to some degree of solder streaking; in essence, the formation of fine solder lines, which remain on the mold surface d...

Claims

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Application Information

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IPC IPC(8): B23K3/00
CPCB23K2201/42B23K3/08B23K2101/42
Inventor BOUCHARD, ERIC E.BROUILLETTE, GUYDANOVITCH, DAVID H.GRUBER, PETER A.LANDREVILLE, JEAN-LUC
Owner IBM CORP
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